| Datenblatt-Suchmaschine für elektronische Bauteile |
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TLE4254EJS Datenblatt(PDF) 7 Page - Infineon Technologies AG |
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TLE4254EJS Datenblatt(HTML) 7 Page - Infineon Technologies AG |
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7 / 21 page ![]() Data Sheet 7 Rev. 1.2, 2009-11-18 TLE4254 General Product Characteristics 4.2 Functional Range Note: Within the functional range the IC operates as described in the circuit description. The electrical characteristics are specified within the conditions given in the related electrical characteristics table. 4.3 Thermal Resistance Pos. Parameter Symbol Limit Values Unit Conditions Min. Max. 4.2.1 Input Voltage V I 445 V V I ≥ VQ + Vdr 4.2.1 Adjust / Enable Input Voltage (Voltage Tracking Range) V ADJ/EN 2.0 – V – 4.2.2 Junction Temperature T j -40 150 °C– 4.2.3 Output Capacitor C Q 1– µF – 1) 1) Not subject to production test; specified by design. 4.2.4 ESR CQ –5 Ω – 1) Pos. Parameter Symbol Limit Values Unit Conditions Min. Typ. Max. PG-DSO-8: 4.3.1 Junction to Ambient R thJA – 155 – K/W Footprint only 1) 2) 1) Not subject to production test; specified by design. 2) Package mounted on PCB FR4; 80 x 80 x 1.5 mm; 35 µm Cu, 5 µm Sn; horizontal position; zero airflow. 4.3.2 – 96 – K/W 300 mm2 PCB heatsink area 1) 2) 4.3.3 – 86 – K/W 600 mm2 PCB heatsink area 2) 1) PG-DSO-8 exposed pad: 4.3.4 Junction to Case R thJC – 15 – K/W measured to exposed pad 4.3.5 Junction to Ambient R thJA –47 – K/W –3) 3) Specified R thJA value is according to Jedec JESD51-2,-5,-7 at natural convection on FR4 2s2p board; The Product (Chip+Package) was simulated on a 76.2 x 114.3 x 1.5 mm³ board with 2 inner copper layers (2 x 70µm Cu, 2 x 35µm Cu). Where applicable a thermal via array under the exposed pad contacted the first inner copper layer. 4.3.6 – 159 – K/W Footprint only 2) 1) 4.3.7 – 71 – K/W 300 mm2 PCB heatsink area 2) 1) 4.3.8 – 60 – K/W 600 mm2 PCB heatsink area 2) 1) |
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