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VRF157FLMP Datenblatt(PDF) 5 Page - Microsemi Corporation

Teilenummer VRF157FLMP
Bauteilbeschribung  RF POWER VERTICAL MOSFET
PDF  5 Pages
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Hersteller  MICROSEMI [Microsemi Corporation]
Direct Link  http://www.microsemi.com
Logo MICROSEMI - Microsemi Corporation

VRF157FLMP Datenblatt(HTML) 5 Page - Microsemi Corporation

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PIN 1 - DRAIN
PIN 2 - SOURCE
PIN 3 - SOURCE
PIN 4 - GATE
1.000
.500
.150r
.500
.466
.750
1.500
1.250
.300
.200
.250
.250
.005 .040
.125d
1
2
4
3
D
S
G
Microsemi’s products are covered by one or more of U.S. patents 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522 5,262,336 6,503,786 5,256,583
4,748,103 5,283,202 5,231,474 5,434,095 5,528,058 6,939,743, 7,352,045 5,283,201 5,801,417 5,648,283 7,196,634 6,664,594 7,157,886 6,939,743 7,342,262
and foreign patents. US and Foreign patents pending. All Rights Reserved.
HAZARDOUS MATERIAL WARNING
The ceramic portion of the device between leads and
mounting flange is beryllium oxide. Beryllium oxide dust
is highly toxic when inhaled. Care must be taken during
handling and mounting to avoid damage to this area.
These devices must never be thrown away with general
industrial or domestic waste.
Thermal
Considerations
and
Package
Mounting:
The rated 1350W power dissipation is only available
when the package mounting surface is at 25°C and
the junction temperature is 200°C. The thermal resis-
tance between junctions and case mounting surface
is 0.13°C/W. When installed, an additional thermal
impedance of 0.09°C/W between the package base
and the mounting surface is smooth and flat. Thermal
joint compound must be used to reduce the effects of
small surface irregularities. The heatsink should incor-
porate a copper heat spreader to obtain best results.
The lid maintains the required mounting pressure while
allowing for thermal expansion of both the device and
the heat sink. Four 6-32 (M3.5) screws provide the
minimum 125 lb. required mounting force. T=4-6 in-lb.
Please refer to App Note 1802 "Mounting Instructions
for Flangeless Packages."
VRF157FL(MP)
Adding MP at the end of P/N specifies a matched pair where V
GS(TH) is matched between the two parts. VTH values
are marked on the devices per the following table.
Code
Vth Range
Code 2
Vth Range
A
2.900 - 2.975
M
3.650 - 3.725
B
2.975 - 3.050
N
3.725 - 3.800
C
3.050 - 3.125
P
3.800 - 3.875
D
3.125 - 3.200
R
3.875 - 3.950
E
3.200 - 3.275
S
3.950 - 4.025
F
3.275 - 3.350
T
4.025 - 4.100
G
3.350 - 3.425
W
4.100 - 4.175
H
3.425 - 3.500
X
4.175 - 4.250
J
3.500 - 3.575
Y
4.250 - 4.325
K
3.575 - 3.650
Z
4.325 - 4.400
V
TH values are based on Microsemi measurements at datasheet conditions with an accuracy of 1.0%.



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