L6230PD datasheet(18/24 Pages) STMICROELECTRONICS

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Application information

L6230

18/24

Doc ID 18094 Rev 2

Figure 16.

Six-step with zero crossing detection typical application

6.4

Thermal management

In most applications the power dissipation in the IC is the main factor that sets the maximum

current that can be delivered by the device in a safe operating condition. Therefore, it has to

be taken into account very carefully. Besides the available space on the PCB, the right

package should be chosen considering the power dissipation. Heat sinking can be achieved

using copper on the PCB with proper area and thickness.

For instance, using a VFQFPN32L 5 x 5 package the typical Rth(JA) is about 42 °C/W when

mounted on a double-layer FR4 PCB with a dissipating copper area of 0.5 cm2 on the top

side plus 6 cm2 ground layer connected through 18 via holes (9 below the IC).

Otherwise, using a PowerSO package with copper slug soldered on a 1.5 mm copper

thickness FR4 board with 6cm2 dissipating footprint (copper thickness of 35 µm), the Rth(jA)

is about 35°C/W.

Using a multi-layer board with vias to a ground plane, thermal impedance can be reduced

down to 15°C/W.

L6230PD Datenblatt(PDF) 18 Page - STMicroelectronics