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ADP151ACBZ-1.2-R7 Datenblatt(PDF) 21 Page - Analog Devices

Teilenummer ADP151ACBZ-1.2-R7
Bauteilbeschribung  Ultralow Noise, 200 mA, CMOS Linear Regulator
PDF  24 Pages
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Hersteller  AD [Analog Devices]
Direct Link  http://www.analog.com
Logo AD - Analog Devices

ADP151ACBZ-1.2-R7 Datenblatt(HTML) 21 Page - Analog Devices

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ADP151
Rev. D | Page 21 of 24
OUTLINE DIMENSIONS
*COMPLIANT TO JEDEC STANDARDS MO-193-AB WITH
THE EXCEPTION OF PACKAGE HEIGHT AND THICKNESS.
1.60 BSC
2.80 BSC
1.90
BSC
0.95 BSC
0.20
0.08
0.60
0.45
0.30
8°
4°
0°
0.50
0.30
0.10 MAX
*1.00 MAX
*0.90 MAX
0.70 MIN
2.90 BSC
5
4
1
2
3
SEATING
PLANE
Figure 63. 5-Lead Thin Small Outline Transistor Package [TSOT]
(UJ-5)
Dimensions show in millimeters
0.050 NOM
COPLANARITY
0.800
0.760 SQ
0.720
0.230
0.200
0.170
0.280
0.260
0.240
0.660
0.600
0.540
0.430
0.400
0.370
BOTTOM VIEW
(BALL SIDE UP)
TOP VIEW
(BALL SIDE DOWN)
A
1
2
B
SEATING
PLANE
0.40
BALL PITCH
BALL A1
IDENTIFIER
Figure 64. 4-Ball Wafer Level Chip Scale Package [WLCSP]
(CB-4-3)
Dimensions show in millimeters
1.70
1.60
1.50
0.425
0.350
0.275
TOP VIEW
6
1
4
3
0.35
0.30
0.25
BOTTOM VIEW
PIN 1 INDEX
AREA
SEATING
PLANE
0.60
0.55
0.50
1.10
1.00
0.90
0.20 REF
0.05 MAX
0.02 NOM
2.00
BSC SQ
0.65 BSC
EXPOSED
PAD
PIN 1
INDICATOR
(R 0.15)
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
Figure 65. 6-Lead Lead Frame Chip Scale Package [LFCSP_UD]
2.00 mm × 2.00 mm Body, Ultra Thin, Dual Lead
(CP-6-3)
Dimensions show in millimeters



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