| Datenblatt-Suchmaschine für elektronische Bauteile |
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SW9N90 Datenblatt(PDF) 1 Page - Xian Semipower Electronic Technology Co., Ltd. |
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SW9N90 Datenblatt(HTML) 1 Page - Xian Semipower Electronic Technology Co., Ltd. |
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1 / 7 page ![]() Mar. 2011. Rev. 3.0 Copyright@ SEMIPOWER Electronic Technology Co., Ltd. All rights reserved. SW SW 9 9N N 90 90 Features ■ High ruggedness ■ R DS(ON) (Max 1.45 Ω)@VGS=10V ■ Gate Charge (Typ 60nC) ■ Improved dv/dt Capability ■ 100% Avalanche Tested General Description This power MOSFET is produced with advanced VDMOS technology of SAMWIN. This technology enable power MOSFET to have better characteristics, such as fast switching time, low on resistance, low gate charge and especially excellent avalanche characteristics. It is mainly suitable for half bridge or full bridge resonant topology like a electronic ballast, and also low power switching mode power appliances. N-channel MOSFET Absolute maximum ratings Symbol Parameter SW9n90 Unit TO-3P VDSS Drain to Source Voltage 900 V ID Continuous Drain Current (@TC=25 oC) 9.0 A Continuous Drain Current (@TC=100 oC) 5.6 A IDM Drain current pulsed (note 1) 36 A VGS Gate to Source Voltage ±30 V EAS Single pulsed Avalanche Energy (note 2) 850 mJ EAR Repetitive Avalanche Energy (note 1) 25 mJ dv/dt Peak diode Recovery dv/dt (note 3) 4.5 V/ns PD Total power dissipation (@TC=25 oC) 240 W Derating Factor above 25oC 1.92 W/oC TSTG, TJ Operating Junction Temperature & Storage Temperature -55 ~ + 150 oC TL Maximum Lead Temperature for soldering purpose, 1/8 from Case for 5 seconds. 300 oC Thermal characteristics Symbol Parameter Value Unit Min. Typ. Max. Rthjc Thermal resistance, Junction to case 0.52 oC/W Rthcs Thermal resistance, Case to Sink 0.24 oC/W Rthja Thermal resistance, Junction to ambient 40 oC/W 1/7 BV DSS : 900V I D : 9.0A R DS(ON) : 1.45ohm 1 2 3 1. Gate 2. Drain 3. Source TO-3P SAMWIN 1 2 3 |
Ähnliche Teilenummer - SW9N90 |
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Ähnliche Beschreibung - SW9N90 |
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