Product family data sheet

cree

Copyright © 2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice.

Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc.

Product descriPtion

XLamp XT-e is Cree’s highest

performing silicon carbide-based

LeD

technology,

delivered

in

Cree’s

industry-standard

XP/XT

packaging.

XT-e White sets the

new standard for high performance

and dramatically lowers system

cost.

XT-e Royal Blue is Cree’s

highest performing source of royal

blue light for remote-phosphor

applications.

Cree XLamp LeDs bring high

performance

and

quality

of

light to a wide range of lighting

applications,

including

remote-

phosphor, color-changing, portable

and personal, outdoor, indoor-

directional, transportation, stage

and

studio,

commercial

and

emergency-vehicle lighting.

features

• Available in white, 80-CRI min

white, 70-min CRI white and

royal blue

• Binned at 85 °C

• Coolwhiteefficacyofupto148

lm/W (@ 85 °C, 350 mA)

• RoyalBluewallplugefficiency

of up to 53% (@ 85 °C, 350

mA)

• Wide viewing angle: 115-140°

• Thermal resistance: 5 °C/W

• Maximum drive current: 1.5 A

• electrically neutral thermal

path

• vf binning supported for XT-e

White and Royal Blue

• XT-e Royal Blue sorted into

2.5-nm-wavelength bins

• Unlimitedfloorlifeat

≤30ºC/85%RH

• Reflowsolderable-JEDEC

J-STD-020CCompatible

• RoHS-andREACH-compliant

taBle of contents

Cree, Inc.

4600 Silicon Drive

Durham, NC 27703

USA Tel: +1.919.313.5300

www.cree.com/xlamp

Copyright © 2011-2012 Cree, Inc. All rights reserved. The information in this document is subject to change without notice.

Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc.

Cree, Inc.

4600 Silicon Drive

Durham, NC 27703

USA Tel: +1.919.313.5300

Product Characteristics............... 2

Flux Characteristics ................... 2

Relative Spectral Power

Distribution............................... 4

RelativeFluxvs.Junction

Temperature ............................. 5

electrical Characteristics............. 6

Relative Flux vs. Current ............ 6

Relative Chromaticity vs.

Temperature and Current............ 8

Typical Spatial Distribution.......... 9

Thermal Design........................10

Reflow-SolderingCharacteristics .10

Notes......................................11

Mechanical Dimensions..............12

Tape and Reel ..........................13

Packaging................................14

note: for remote phosphor applications, a separate license to certain cree patents is required.