SC403B datasheet(28/32 Pages) SEMTECH

28 / 32 page

SC403B

Applications Information (continued)

All other decoupling capacitors must be located

as close as possible to the IC.

PGND Plane

PGND requires its own copper plane with no

other signal traces routed on it.

Copper planes, multiple vias and wide traces are

needed to connect PGND to input capacitors,

output capacitors, and the PGND pins on the

device.

The PGND copper area between the input

capacitors, output capacitors, and PGND pins

must be as tight and compact as possible to

reduce the area of the PCB that is exposed to

noise due to current flow on this node.

Connect PGND to AGND with a short trace or

0Ω resistor. This connection should be as close

to the device as possible.

•

VOUT Plane on top

and bottom layer

CIN

RFB2

RFB1

LX plane on top and

bottom layer

All components

shown Top Side

AGND plane on

inner layer

VIN plane on

top and/or

bottom layer

RGND — AGND connects to

PGND close to IC

Pin 1 marking

IC with vias for

LX, AGND, VIN

COUT

PGND on inner

or bottom layer

Vout sense trace

on inner layer

VDD Decoupling Capacitor

Cer.

CIN

SP or

POSCAP

CTOP

PGND on top

layer

Figure 15 — PCB Layout

PCB Layout Guidelines

The optimum layout for the SC403B is shown in Figure 15.

This layout shows an integrated FET buck regulator with a

maximum current of 6A. The total PCB area is approxi-

mately 25 x 29 mm.

Critical Layout Guidelines

The following critical layout guidelines must be followed

to ensure proper performance of the device.

IC decoupling capacitors

PGND plane

AGND island

FB, VOUT, and other analog control signals

BST, ILIM, and LX

CIN and COUT placement and current loops

IC Decoupling Capacitors

A 0.1 μF capacitor must be located as close as

possible to the IC and directly connected to pins

3 (VDD) and 4 (AGND).

•

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