FDVE0630-R75M datasheet(5/28 Pages) AD

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Data Sheet

ADP2381

Rev. 0 | Page 5 of 28

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

PVIN, PGOOD

−0.3 V to +22 V

−1 V to +22 V

BST

SW + 6 V

UVLO, FB, EN/SS, COMP, SYNC, RT

−0.3 V to +6 V

VREG, LD

−0.3 V to +12 V

PGND to GND

−0.3 V to +0.3 V

Operating Junction Temperature Range

−40°C to +125°C

Storage Temperature Range

−65°C to +150°C

Soldering Conditions

JEDEC J-STD-020

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

Absolute maximum ratings apply individually only, not in

combination. Unless otherwise specified, all other voltages are

referenced to GND.

THERMAL INFORMATION

Table 3. Thermal Resistance

Package Type

Unit

16-lead TSSOP_EP

39.48

°C/W

JA is specified for the worst-case conditions, that is, a device

soldered in circuit board (4-layer, JEDEC standard board) for

surface-mount packages.

ESD CAUTION

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