ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.

These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave

soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming

Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

AP02001 Rev. 52

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Suggested Pad Layout

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TSOT26

Dimensions

Value (in mm)

C

0.950

X

0.700

Y

1.000

Y1

3.199

TSSOP-14

Dimensions

Value (in mm)

X

0.45

Y

1.45

C1

5.9

C2

0.65

TSSOP-16

Dimensions

Value

(in mm)

C

0.650

X

0.350

X1

4.900

Y

1.400

Y1

6.800

Y1

C

C

X (6x)

Y (6x)

X

C1

C2

Y

X1

Y (16x)

Y1

X (16x)

1

C