TM124BBK32H, TM124BBK32I 1048576 BY 32-BIT

TM248CBK32H, TM248CBK32I 2097152 BY 32-BIT

DYNAMIC RAM MODULES

SMMS679 – MARCH 1997

3

POST OFFICE BOX 1443

operation (continued)

Table 1. Connection Table

DATA BLOCK

RASx

CASx

DATA BLOCK

SIDE 1

SIDE 2†

CASx

DQ0 – DQ7

RAS0

RAS1

CAS0

DQ8 – DQ15

RAS0

RAS1

CAS1

DQ16 – DQ23

RAS2

RAS3

CAS2

DQ24 – DQ31

RAS2

RAS3

CAS3

† Side 2 applies to the TM248CBK32H/I only.

single in-line memory module and components

PC substrate: 1,27

± 0,1 mm (0.05 inch) nominal thickness; 0.005 inch/inch maximum warpage

Bypass capacitors: Multilayer ceramic

Contact area for TM124BBK32H and TM248CBK32H: Nickel plate and gold plate over copper

Contact area for TM124BBK32I and TM248CBK32I: Nickel plate and tin / lead over copper

functional block diagram ( TM124BBK32H/I and TM248CBK32H/I, side 1)

1M

× 16

A0 –A9

DQ0 –

RAS

DQ7

W

LCAS

DQ8 –

UCAS

DQ15

A0 – A9

D8 – D15

D24 – D31

W

RAS0

CAS0

CAS1

RAS2

10

10

10

D0 – D7

D16 – D23

1M

× 16

A0 –A9

DQ0 –

RAS

DQ7

W

LCAS

DQ8 –

UCAS

DQ15

CAS2

CAS3

functional block diagram ( TM248CBK32H/I, side 2 )

1M

× 16

A0 –A9

DQ0 –

RAS

DQ7

W

LCAS

DQ8 –

UCAS

DQ15

A0 – A9

D0 – D7

D16 – D23

W

RAS1

CAS1

CAS0

RAS3

10

10

10

D8 – D15

D24 – D31

1M

× 16

A0 –A9

DQ0 –

RAS

DQ7

W

LCAS

DQ8 –

UCAS

DQ15

CAS3

CAS2