TM124MBK36C, TM124MBK36S 1048576 BY 36-BIT

TM248NBK36C, TM248NBK36S 2097152 BY 36-BIT

DYNAMIC RAM MODULE

SMMS138B – MARCH 1992 – REVISED JUNE 1995

4

POST OFFICE BOX 1443

Table 1. Connection Table

DATA BLOCK

RASx

CASx

DATA BLOCK

SIDE 1

SIDE 2†

CASx

DQ0 – DQ7

DQ8

RAS0

RAS0

RAS1

RAS1

CAS0

CAS0

DQ9 – DQ16

DQ17

RAS0

RAS0

RAS1

RAS1

CAS1

CAS1

DQ18 – DQ25

DQ26

RAS2

RAS2

RAS3

RAS3

CAS2

CAS2

DQ27 – DQ34

DQ35

RAS2

RAS2

RAS3

RAS3

CAS3

CAS3

† Side 2 applies to the TM248NBK36C only.

single-in-line memory module and components

PC substrate: 1,27

± 0,1 mm (0.05 inch) nominal thickness; 0.005 inch/inch maximum warpage

Bypass capacitors: Multilayer ceramic

Contact area for TM124MBK36C and TM248NBK36C: Nickel plate and gold plate over copper

Contact area for TM124MBK36S and TM248NBK36S: Nickel plate and tin-lead over copper