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TMP87CH47LUG Datenblatt(PDF) 3 Page - Toshiba Semiconductor

Teilenummer TMP87CH47LUG
Bauteilbeschribung  TLCS-870 Series
PDF  97 Pages
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Hersteller  TOSHIBA [Toshiba Semiconductor]
Direct Link  http://www.semicon.toshiba.co.jp/eng
Logo TOSHIBA - Toshiba Semiconductor

TMP87CH47LUG Datenblatt(HTML) 3 Page - Toshiba Semiconductor

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TMP87C447/847/H47/847L/H47L
II
2008-03-06
1. Part number
2. Package code and dimensions
Previous Part Number
(in Body Text)
Previous Package Code
(in Body Text)
New Part Number
New Package Code
OTP
TMP87C447U
QFP44-P-1010-0.80
TMP87C447UG
LQFP44-P-1010-0.80A
TMP87PH47UG
TMP87C847U
QFP44-P-1010-0.80
TMP87C847UG
LQFP44-P-1010-0.80A
TMP87PH47UG
TMP87CH47U
QFP44-P-1010-0.80
TMP87CH47UG
LQFP44-P-1010-0.80A
TMP87PH47UG
TMP87C847LU
QFP44-P-1010-0.80
TMP87C847LUG
LQFP44-P-1010-0.80A
TMP87PH47LUG
TMP87CH47LU
QFP44-P-1010-0.80
TMP87CH47LUG
LQFP44-P-1010-0.80A
TMP87PH47LUG
*: For the dimensions of the new package, see the attached Package Dimensions diagram.
3. Addition of notes on lead solderability
The following solderability test is conducted on the new device.
Lead solderability of Pb-free devices (with the G suffix)
Test
Test Conditions
Remark
Solderability
(1) Use of Lead (Pb)
·
solder bath temperature
= 230°C
·
dipping time
= 5 seconds
·
the number of times
= once
·
use of R-type flux
(2) Use of Lead (Pb)-Free
·
solder bath temperature
= 245°C
·
dipping time
= 5 seconds
·
the number of times
= once
·
use of R-type flux
Leads with over 95% solder coverage
till lead forming are acceptable.



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