Package information

RHF310

20/22

Doc ID 15577 Rev 3

8.1

Ceramic Flat-8 package information

Figure 28.

Ceramic Flat-8 package mechanical drawing

Note:

The upper metallic lid is not electrically connected to any pins, nor to the IC die inside the

package. Connecting unused pins or metal lid to ground or to the power supply will not affect

the electrical characteristics.

Table 6.

Ceramic Flat-8 package mechanical data

Ref.

Dimensions

Millimeters

Inches

Min.

Typ.

Max.

Min.

Typ.

Max.

A

2.24

2.44

2.64

0.088

0.096

0.104

b

0.38

0.43

0.48

0.015

0.017

0.019

c

0.10

0.13

0.16

0.004

0.005

0.006

D

6.35

6.48

6.61

0.250

0.255

0.260

E

6.35

6.48

6.61

0.250

0.255

0.260

E2

4.32

4.45

4.58

0.170

0.175

0.180

E3

0.88

1.01

1.14

0.035

0.040

0.045

e

1.27

0.050

L

3.00

0.118

Q

0.66

0.79

0.92

0.026

0.031

0.092

S1

0.92

1.12

1.32

0.036

0.044

0.052

N08

08