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STA3398 Datenblatt(PDF) 73 Page - STMicroelectronics

Teilenummer STA3398
Bauteilbeschribung  2.1-channel high-efficiency digital audio system
PDF  77 Pages
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Hersteller  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STA3398 Datenblatt(HTML) 73 Page - STMicroelectronics

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STA339BW
Package thermal characteristics
Doc ID 15251 Rev 5
73/77
8
Package thermal characteristics
Using a double-layer PCB the thermal resistance junction to ambient with 2 copper ground
areas of 3 x 3 cm2 and with 16 via holes (see Figure 24) is 24 °C/W in natural air convection.
The dissipated power within the device depends primarily on the supply voltage, load
impedance and output modulation level.
Thus, the maximum estimated dissipated power for the STA339BW is:
Figure 24.
Double-layer PCB with 2 copper ground areas and 16 via holes
Figure 25 shows the power derating curve for the PowerSSO-36 slug-down package on
PCBs with copper areas of 2 x 2 cm2 and 3 x 3 cm2.
Figure 25.
PowerSSO-36 power derating curve
2 x 20 W @ 8
Ω, 18 V
Pd max ~ 4 W
2 x 10 W + 1 x 20 W @ 4
Ω, 8 Ω, 18 V
Pd max < 5 W
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Pd (W)
Tamb ( °C)
Copper Area 2x2 cm
and via holes
STA339BW
PSSO36
Copper Area 3x3 cm
and via holes
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Pd (W)
Tamb ( °C)
Copper Area 2x2 cm
and via holes
STA339BW
PSSO36
Copper Area 3x3 cm
and via holes
STA339BW
PowerSSO-36



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