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CXG1127ER

Sony Corporation

Package Outline

Unit: mm

C

SONY CODE

EIAJ CODE

JEDEC CODE

PACKAGE MATERIAL

LEAD TREATMENT

LEAD MATERIAL

PACKAGE MASS

EPOXY RESIN

SOLDER PLATING

COPPER ALLOY

PACKAGE STRUCTURE

4.0

3.6

A

B

0.05 M S A-B C

VQFN-24P-03

24PIN VQFN(PLASTIC)

0.04g

0.1 S A-B C

x 4

x 4

0.4

0.05

0.7

1.0

0.6 ± 0.1

45˚

0.9 ± 0.1

S

PIN 1 INDEX

1

7

12

13

18

19

24

6

0.1 S A-B C

S

TERMINAL SECTION

Solder Plating

0.14 – 0.03

0.13 ± 0.025

+ 0.09

ranges of 0.1mm and 0.25mm from the end of a terminal.

NOTE:1) The dimensions of the terminal section apply to the

LEAD SPECIFICATIONS

ITEM

LEAD MATERIAL

COPPER ALLOY

LEAD TREATMENT

Sn-Bi 2.5%

LEAD TREATMENT THICKNESS

5-18µm

SPEC.