STPS1150_11 datasheet(5/11 Pages) STMICROELECTRONICS

5 / 11 page

STPS1150

Characteristics

Doc ID 9472 Rev 5

5/11

Figure 13.

Reverse leakage current versus

reverse voltage applied (typical

values)

Figure 14.

Junction capacitance versus

reverse voltage applied (typical

values)

I (µA)

1.E-03

1.E-02

1.E-01

1.E+00

1.E+01

1.E+02

1.E+03

1.E+04

100

125

150

T =125°C

T =150°C

T =100°C

T =50°C

T =25°C

T =75°C

V (V)

C(pF)

100

1000

F=1MHz

=30mV

T =25°C

OSC

RMS

V (V)

Figure 15.

Forward voltage drop versus

forward current (all packages)

Figure 16.

Thermal resistance junction to

ambient versus copper surface

under tab (STmite)

(A)

0.0

0.5

1.0

1.5

2.0

2.5

3.0

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

(V)

T =125°C

(maximum values)

T =125°C

(typical values)

T =25°C

(maximum values)

100

125

150

175

200

225

250

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

STmite

(°C/W)

th(j-a)

S (cm²)

Epoxy printed circuit board,

copper thickness = 35 µm

Figure 17.

Thermal resistance junction to

ambient versus copper surface

under tab (STmite flat)

Figure 18.

Thermal resistance junction to

ambient versus copper surface

under each lead (SMA)

100

125

150

175

200

225

250

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

STmite flat

(°C/W)

th(j-a)

S (cm²)

Epoxy printed circuit board,

copper thickness = 35 µm

(°C/W)

th(j-a)

100

110

120

130

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

S (cm²)

Epoxy printed circuit board,

copper thickness = 35 µm

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