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TS556 Datenblatt(PDF) 15 Page - STMicroelectronics |
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TS556 Datenblatt(HTML) 15 Page - STMicroelectronics |
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15 / 19 page ![]() TS556 Package information 15/19 5.1 DIP14 package information Figure 8. DIP14 package mechanical drawing Note: D and E1 dimensions do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm. Table 11. DIP14 package mechanical data Dimensions Ref. Millimeters Inches Min. Typ. Max. Min. Typ. Max. A5.33 0.21 A1 0.38 0.015 A2 2.92 3.30 4.95 0.11 0.13 0.19 b 0.36 0.46 0.56 0.014 0.018 0.022 b2 1.14 1.52 1.78 0.04 0.06 0.07 c 0.20 0.25 0.36 0.007 0.009 0.01 D 18.67 19.05 19.69 0.73 0.75 0.77 E 7.62 7.87 8.26 0.30 0.31 0.32 E1 6.10 6.35 7.11 0.24 0.25 0.28 e2.54 0.10 e1 15.24 0.60 eA 7.62 0.30 eB 10.92 0.43 L 2.92 3.30 3.81 0.11 0.13 0.15 |
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