WM8523 datasheet(49/51 Pages) WOLFSON

49 / 51 page

Production Data

WM8523

PD, Rev 4.1, August 2011

PACKAGE DIMENSIONS – 24-LEAD QFN

DM061.A

FL: 24 PIN QFN PLASTIC PACKAGE 4 X 4 X 0.75 mm BODY, 0.50 mm LEAD PITCH

INDEX AREA

(D/2 X E/2)

TOP VIEW

NOTES:

1. DIMENSION b APPLIES TO METALLIZED TERMINAL AND IS MEASURED BETWEEN 0.15 mm AND 0.30 mm FROM TERMINAL TIP.

2. FALLS WITHIN JEDEC, MO-220.

3. ALL DIMENSIONS ARE IN MILLIMETRES.

4. THE TERMINAL #1 IDENTIFIER AND TERMINAL NUMBERING CONVENTION SHALL CONFORM TO JEDEC 95-1 SPP-002.

5. COPLANARITY APPLIES TO THE EXPOSED HEAT SINK SLUG AS WELL AS THE TERMINALS.

6. REFER TO APPLICATIONS NOTE WAN_0118 FOR FURTHER INFORMATION REGARDING PCB FOOTPRINTS AND QFN PACKAGE SOLDERING.

7. DEPENDING ON THE METHOD OF LEAD TERMINATION AT THE EDGE OF THE PACKAGE, PULL BACK (L1) MAY BE PRESENT.

8. THIS DRAWING IS SUBJECT TO CHANGE WITHOUT NOTICE.

DETAIL 1

bbb M

BOTTOM VIEW

aaa

2 X

aaa

2 X

SEATING PLANE

DETAIL 3

0.08

ccc

SIDE VIEW

EXPOSED

GROUND

PADDLE

DETAIL 1

0.3mm

degrees

EXPOSED

GROUND

PADDLE

SEE DETAIL 2

Exposed lead

DETAIL 3

Symbols

MIN

NOM

MAX

NOTE

0.70

0.75

0.80

0.05

0.02

0.203 REF

0.30

0.20

4.00 BSC

2.75

2.70

2.65

0.50 BSC

0.35

0.40

0.45

4.00 BSC

2.75

2.70

2.65

0.10

aaa

bbb

ccc

REF:

0.15

0.10

JEDEC, MO-220

Tolerances of Form and Position

0.25

0.625

Datum

DETAIL 2

Terminal

Tip

e/2

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