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RT8288 Datenblatt(PDF) 12 Page - Richtek Technology Corporation

Teilenummer RT8288
Bauteilbeschribung  3A, 21V 500kHz Synchronous Step-Down Converter
PDF  14 Pages
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Hersteller  RICHTEK [Richtek Technology Corporation]
Direct Link  http://www.richtek.com
Logo RICHTEK - Richtek Technology Corporation

RT8288 Datenblatt(HTML) 12 Page - Richtek Technology Corporation

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RT8288
12
DS8288-03
June 2012
www.richtek.com
©
Copyright
2012 Richtek Technology Corporation. All rights reserved.
is a registered trademark of Richtek Technology Corporation.
Figure 5. Reference Circuit with Snubber and Enable Timing Control
Thermal Considerations
For continuous operation, do not exceed absolute
maximum junction temperature. The maximum power
dissipation depends on the thermal resistance of the IC
package, PCB layout, rate of surrounding airflow, and
difference between junction and ambient temperature. The
maximum power dissipation can be calculated by the
following formula :
PD(MAX) = (TJ(MAX)
− TA) / θJA
where TJ(MAX) is the maximum junction temperature, TA is
the ambient temperature, and
θJAis the junction to ambient
thermal resistance.
For recommended operating condition specifications, the
maximum junction temperature is 125
°C. The junction to
ambient thermal resistance,
θJA, is layout dependent. For
SOP-8 (Exposed Pad) package, the thermal resistance,
θJA, is 75°C/W on a standard JEDEC 51-7 four-layer
thermal test board. The maximum power dissipation at TA
= 25
°C can be calculated by the following formula :
PD(MAX) = (125
°C − 25°C) / (75°C/W) = 1.333W for
SOP-8 (Exposed Pad) package
Figure 6. Derating Curve of Maximum Power Dissipation
VIN
VCC
BOOT
FB
SW
6
1
2, 3
4
L
R1
R2
VOUT
VIN
RT8288
7
CBOOT
COUT
CIN
RT
GND
8, 9 (Exposed Pad)
EN
CC
5
CS*
RS*
REN*
CEN*
* : Optional
reducing the SW trace area and keeping the main power
in a small loop will be helpful on EMI performance. For
detailed PCB layout guide, please refer to the section
Layout Considerations.
The maximum power dissipation depends on the operating
ambient temperature for fixed TJ(MAX) and thermal
resistance,
θJA. The derating curve in Figure 6 allows the
designer to see the effect of rising ambient temperature
on the maximum power dissipation.
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
0
25
50
75
100
125
Ambient Temperature (°C)
Four-Layer PCB



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