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RT8288 Datenblatt(PDF) 12 Page - Richtek Technology Corporation |
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RT8288 Datenblatt(HTML) 12 Page - Richtek Technology Corporation |
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12 / 14 page ![]() RT8288 12 DS8288-03 June 2012 www.richtek.com © Copyright 2012 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation. Figure 5. Reference Circuit with Snubber and Enable Timing Control Thermal Considerations For continuous operation, do not exceed absolute maximum junction temperature. The maximum power dissipation depends on the thermal resistance of the IC package, PCB layout, rate of surrounding airflow, and difference between junction and ambient temperature. The maximum power dissipation can be calculated by the following formula : PD(MAX) = (TJ(MAX) − TA) / θJA where TJ(MAX) is the maximum junction temperature, TA is the ambient temperature, and θJAis the junction to ambient thermal resistance. For recommended operating condition specifications, the maximum junction temperature is 125 °C. The junction to ambient thermal resistance, θJA, is layout dependent. For SOP-8 (Exposed Pad) package, the thermal resistance, θJA, is 75°C/W on a standard JEDEC 51-7 four-layer thermal test board. The maximum power dissipation at TA = 25 °C can be calculated by the following formula : PD(MAX) = (125 °C − 25°C) / (75°C/W) = 1.333W for SOP-8 (Exposed Pad) package Figure 6. Derating Curve of Maximum Power Dissipation VIN VCC BOOT FB SW 6 1 2, 3 4 L R1 R2 VOUT VIN RT8288 7 CBOOT COUT CIN RT GND 8, 9 (Exposed Pad) EN CC 5 CS* RS* REN* CEN* * : Optional reducing the SW trace area and keeping the main power in a small loop will be helpful on EMI performance. For detailed PCB layout guide, please refer to the section Layout Considerations. The maximum power dissipation depends on the operating ambient temperature for fixed TJ(MAX) and thermal resistance, θJA. The derating curve in Figure 6 allows the designer to see the effect of rising ambient temperature on the maximum power dissipation. 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 0 25 50 75 100 125 Ambient Temperature (°C) Four-Layer PCB |
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