FPF1203 datasheet(1/3 Pages) FAIRCHILD

Teilenummer	FPF1203

Bauteilbeschribung	IntelliMAX??Ultra-Small, Slew-Rate-Controlled Load Switch

PDF	3 Pages

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Hersteller	FAIRCHILD [Fairchild Semiconductor]

Direct Link	http://www.fairchildsemi.com

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November 2012

www.fairchildsemi.com

FPF1203 / FPF1203L / FPF1204 / FPF12045 • Rev. 1.1.9

FPF1203 / FPF1203L / FPF1204 / FPF12045

IntelliMAX™ Ultra-Small, Slew-Rate-Controlled Load Switch

Features

 1.2 V to 5.5 V Input Voltage Operating Range

 Typical RON:



45 mΩ at VIN=5.5 V



55 mΩ at VIN=3.3 V



90 mΩ at VIN=1.8 V



185 mΩ at VIN=1.2 V

 Slew Rate Control with tR:



FPF1203/FPF1203l/FPF1204: 100 µs



FPF12045: 2 µs

 Output Discharge Function on FPF1204 / 45

 Low <1.5 µA Quiescent Current

 ESD Protected: Above 7 kV HBM, 2 kV CDM

 GPIO / CMOS-Compatible Enable Circuitry

 4-Bump, WLCSP 0.76 mm x 0.76 mm, 0.4 mm

Pitch

Applications

 Mobile Devices and Smart Phones

 Portable Media Devices

 Tablet PCs

 Advanced Notebook, UMPC, MID

 Portable Medical Devices

 GPS and Navigation Equipment

Description

The FPF1203 /03L / 04 / 45 are ultra-small integrated

IntelliMAX™ load switches with integrated P-channel

switch and analog control features. Integrated slew-rate

control prevents inrush current and the resulting

excessive voltage drop on the power rail. The input

voltage range operates from 1.2 V to 5.5 V to provide

power-disconnect capability for post-regulated power

rails in portable and consumer products. The low shut-

off current of 1 µA (maximum) allows power designs to

meet standby and off-power drain specifications.

The FPF1203 / 03L / 04 / 45 are controlled by a logic

input (ON pin) compatible with standard CMOS GPIO

circuitry found on Field Programmable Gate Array

(FPGA) embedded processors. The FPF1203 / 03L / 04

/ 045 are available in 0.76 mm x 0.76 mm 4-bump

WLCSP.

Ordering Information

Part Number

Top

Mark

Switch

(Typical)

at 3.3VIN

Output

Discharge

ON Pin

Activity

tR

Package

FPF1203UCX

QL

55 mΩ

NA

Active HIGH

100 µs

4-Bump, Wafer-Level Chip-Scale

Package (WLCSP), 0.76 mm x

0.76 mm, 0.4 mm Pitch

FPF1204UCX

QM

55 mΩ

65Ω

Active HIGH

100 µs

FPF1204BUCX

(Backside Laminate)

QM

55 mΩ

65Ω

Active HIGH

100 µs

FPF12045UCX

NC

55 mΩ

65Ω

Active HIGH

2 µs

FPF1203LUCX

(Preliminary)

QP

55 mΩ

n/a

Active LOW

100 µs

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