www.berex.com

BeRex, Inc. 1735 North 1

Specifications are subject to change without notice. ©BeRex 2012

Rev. 1.7

BCL016B

Exceeding any of the above Maximum Ratings will result in reduced MTTF and may cause permanent damage to the device.

Freq

[GHz]

S11

[MAG]

S11

[Ang]

S21

[MAG]

S21

[Ang]

S12

[MAG]

S12

[Ang]

S22

[MAG]

S22

[Ang]

1

0.99

-11.25

5.95

169.63

0.017

83.73

0.54

-5.90

2

0.98

-22.22

5.93

160.06

0.033

76.58

0.53

-11.65

3

0.97

-32.54

5.68

151.26

0.048

70.53

0.51

-17.14

4

0.95

-44.55

5.73

142.08

0.062

64.57

0.48

-21.53

5

0.93

-54.26

5.52

133.35

0.076

58.37

0.44

-27.50

6

0.91

-65.76

5.59

124.70

0.089

53.16

0.40

-32.21

7

0.88

-79.02

5.45

114.83

0.101

45.48

0.33

-42.00

8

0.85

-90.99

5.42

106.08

0.113

40.18

0.28

-45.56

9

0.82

-101.41

5.31

97.75

0.125

33.41

0.23

-58.00

10

0.78

-116.54

5.22

87.78

0.133

26.50

0.15

-73.89

11

0.74

-131.03

5.13

78.33

0.143

19.24

0.11

-103.09

12

0.68

-150.07

5.00

66.81

0.151

10.38

0.13

-157.16

13

0.66

-169.47

4.69

56.28

0.153

2.15

0.18

164.27

14

0.63

168.75

4.46

45.46

0.157

-6.54

0.26

148.69

15

0.64

145.31

4.10

33.81

0.154

-16.06

0.36

135.43

16

0.66

124.37

3.70

23.23

0.148

-24.06

0.44

126.12

17

0.69

102.63

3.30

11.86

0.141

-32.66

0.51

119.95

18

0.73

88.34

2.85

3.09

0.130

-38.61

0.57

111.43

19

0.76

75.06

2.48

-5.82

0.120

-43.78

0.62

106.03

20

0.80

59.85

2.12

-15.00

0.109

-48.60

0.65

101.91

21

0.82

52.72

1.80

-21.27

0.100

-50.84

0.67

98.55

22

0.84

42.62

1.52

-28.44

0.093

-53.53

0.69

96.42

23

0.86

35.06

1.23

-34.89

0.084

-57.23

0.71

92.69

24

0.89

32.73

1.04

-38.66

0.076

-60.50

0.73

90.55

25

0.91

24.09

0.86

-43.76

0.062

-61.13

0.76

89.32

26

0.93

19.10

0.69

-48.13

0.054

-60.20

0.77

88.42

NOTE: S-parameters include 12 mil gold bond wires: 1 gate wire, 1 drain wire, 4 source wires. Reference planes are at the edge

of substrates shown in the “Wire Bonding Information” figure below

.

SYMBOLS

PARAMETERS

ABSOLUTE

Drain-Source Voltage

Gate-Source Voltage

Drain Current

Forward Gate Current

Input Power

Channel Temperature

Storage Temperature

Total Power Dissipation

5 V

-3 V

50 mA

30 mA

20 dBm

150° C

-60° C - 150° C

200 mW