PCF8523TSSLASH1 datasheet(2/75 Pages) NXP

2 / 75 page

PCF8523

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Product data sheet

Rev. 4 — 5 July 2012

2 of 74

NXP Semiconductors

PCF8523

Real-Time Clock (RTC) and calendar

Ordering information

4.1 Ordering options

[1]

Bump hardness see Table 53.

Marking

Table 1.

Ordering information

Type number

Package

Name

Description

Version

PCF8523T

SO8

plastic small outline package; 8 leads;

body width 3.9 mm

SOT96-1

PCF8523TK

HVSON8

plastic thermal enhanced very thin small outline

package; no leads; 8 terminals;

body 4

 4  0.85 mm

SOT909-1

PCF8523TS

TSSOP14

plastic thin shrink small outline package; 14 leads;

body width 4.4 mm

SOT402-1

PCF8523U

bare die

12 bumps (6-6)

PCF8523U

Table 2.

Ordering options

Type number

revision

Sales item

(12NC)

Bump type

Delivery form

PCF8523T/1

935293581118

tape and reel, 13 inch

PCF8523TK/1

935293573118

tape and reel, 13 inch

PCF8523TS/1

935291196112

tube

935291196118

tape and reel, 13 inch

PCF8523U/12AA/1

935293887005

soft gold bumps[1]

sawn wafer on Film Frame Carrier (FFC)

Table 3.

PCF8523U wafer information

Type number

Wafer thickness

Wafer diameter

FFC for wafer size

Marking of bad die

PCF8523U/12AA/1

200

m

6 inch

8 inch

wafer mapping

Table 4.

Marking codes

Type number

Marking code

PCF8523T/1

8523T

PCF8523TK/1

8523

PCF8523TS/1

8523TS

PCF8523U/12AA/1

PC8523-1

PCF8523TS/1 Datenblatt(PDF) 2 Page - NXP Semiconductors

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