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AOZ1401DI Datenblatt(PDF) 2 Page - Alpha & Omega Semiconductors

Teilenummer AOZ1401DI
Bauteilbeschribung  Li Charger Protection IC
PDF  14 Pages
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Hersteller  AOSMD [Alpha & Omega Semiconductors]
Direct Link  http://www.aosmd.com
Logo AOSMD - Alpha & Omega Semiconductors

AOZ1401DI Datenblatt(HTML) 2 Page - Alpha & Omega Semiconductors

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AOZ1401DI
Rev. 1.0 August 2011
www.aosmd.com
Page 2 of 14
Ordering Information
All AOS products are offered in packages with Pb-free plating and compliant to RoHS standards.
Parts marked as Green Products (with “L” suffix) use reduced levels of Halogens, and are also RoHS compliant.
Please visit www.aosmd.com/web/quality/rohs_compliant.jsp for additional information.
Pin Configuration
Pin Description
Part Number
Ambient Temperature Range
Package
Environmental
AOZ1401DI
-40°C to +85°C
2 x 2 DFN-8
RoHS Compliant
1
2
3
4
8
7
6
5
OUT
ILIM
VBAT
ENB
Top View
(DFN 2x2)
AOZ1401DI
VIN
GND
NC
FAULTB
Pin
Name
Pin
Number
I/O
Description
VIN
1
I
Input power, connect to external DC supply. Connect external 1μF (minimum) to GND
GND
2
Ground terminal
NC
3
These pins may have internal circuits used for test purposes. Do not make any external
connections at these pins for normal operation.
FAULTB
4
O
Open-drain output, device status. FAULTB = LO indicates that the input FET has been turned
off due to input over-voltage or input over-current conditions, or because the battery voltage is
outside safe limits.
ENB
5
I
Chip enable input. Active low. When ENB = HI, the input FET is off. Internally pulled down.
VBAT
6
I
Battery voltage sense input. Connect to pack positive terminal through a resistor.
ILIM
7
I/O
Input over-current threshold programming. Connect a resistor to GND to set the over-current
threshold.
OUT
8
O
Output terminal to the charging system. Connect external 1μF capacitor (minimum) to GND
Thermal PAD
There is an internal electrical connection between the exposed thermal pad and the GND pin
of the device. The thermal pad must be connected to the same potential as the GND pin on
the printed circuit board. Do not use the thermal pad as the primary ground input for the
device. GND pin must be connected to ground at all times.



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