OP275

REV. A

–3–

Parameter

Symbol

Conditions

Limit

Units

Offset Voltage

1mV max

Input Bias Current

350

nA max

Input Offset Current

50

nA max

Input Voltage Range

1

±10.5

V min

Common-Mode Rejection Ratio

CMRR

±10.5 V

80

dB min

Power Supply Rejection Ratio

PSRR

V =

±4.5 V to ±18 V

85

dB min

Large Signal Voltage Gain

Ω

250

V/mV min

Output Voltage Range

Ω±13.5

V min

Supply Current

5

mA max

NOTES

Electrical tests and wafer probe to the limits shown. Due to variations in assembly methods and normal yield loss, yield after packaging is not guaranteed for standard

product dice. Consult factory to negotiate specifications based on dice lot qualifications through sample lot assembly and testing.

Specifications subject to change without notice.

ABSOLUTE MAXIMUM RATINGS

1

Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

±22 V

Input Voltage

±22 V

Differential Input Voltage

±7.5 V

Output Short-Circuit Duration to GND

3

. . . . . . . . . Indefinite

Storage Temperature Range

P, S Package . . . . . . . . . . . . . . . . . . . . . . . . –65

°C to +150°C

Operating Temperature Range

OP275G . . . . . . . . . . . . . . . . . . . . . . . . . . . . –40

°C to +85°C

Junction Temperature Range

P, S Package . . . . . . . . . . . . . . . . . . . . . . . . –65

°C to +150°C

Lead Temperature Range (Soldering, 60 sec) . . . . . . . +300

°C

Package Type

θ

JA

4

θ

JC

Units

8-Pin Plastic DIP (P)

103

43

°C/W

8-Pin SOIC (S)

158

43

°C/W

NOTES

otherwise noted.

±22 V, the absolute maximum input voltage is

equal to the supply voltage.

4

θ

θ

for cerdip, P-DIP, and LCC packages;

θ

board for SOIC package.

WARNING!

ESD SENSITIVE DEVICE

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily

accumulate on the human body and test equipment and can discharge without detection.

Although the OP275 features proprietary ESD protection circuitry, permanent damage may

occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD

precautions are recommended to avoid performance degradation or loss of functionality.

ORDERING GUIDE

Model

Temperature Range

Package Option

OP275GP

–40

°C to +85°C

8-Pin Plastic DIP

OP275GS

–40

°C to +85°C

8-Pin SOIC

OP275GSR

–40

°C to +85°C

SO-8 Reel, 2500 pcs.

OP275GBC

+25

°C

DICE

DICE CHARACTERISTICS

Die Size 0.070

× 0.108 in. (7,560 sq. mils)

Substrate is connected to V–