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184PC15GT Datenblatt(PDF) 2 Page - Honeywell Solid State Electronics Center

Teilenummer 184PC15GT
Bauteilbeschribung  Pressure Sensors Miniature Absolute, Differential, Gage/Amplified
PDF  5 Pages
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Hersteller  HONEYWELL [Honeywell Solid State Electronics Center]
Direct Link  http://honeywell.com/Pages/Home.aspx
Logo HONEYWELL - Honeywell Solid State Electronics Center

184PC15GT Datenblatt(HTML) 2 Page - Honeywell Solid State Electronics Center

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Pressure Sensors
180PC Series
Miniature Absolute, Differential, Gage/Amplified
Honeywell Sensing and Control 1-800-537-6945 USA
1-815-235-6847 International 1-800-737-3360 Canada
45
Terminal Mount
Housing Mount
FEATURES
Miniature plastic package
Terminal and housing mount styles
PCB termination
Fully signal conditioned
180PC SERIES PERFORMANCE CHARACTERISTICS at 8.0 ±0.01 VDC
Excitation, 25°C
Min.
Typ.
Max.
Units
Excitation
7.00
8.00
16
VDC
Supply Current
---
---
6
mA
Current Sourcing Output
---
---
10
mA
Null Offset (184/185PC)
0.95
1.00
1.05
V
Null Offset (186PC)
3.45
3.50
3.55
V
Null Offset
185PC15AT @ 2 psia
1.62
1.67
1.72
V
185PC30AT @ 2 psia
1.28
1.33
1.38
V
Output at Full Pressure (184/185PC, G,D)
5.90
6.00
6.15
V
Output at Full Pressure (185PC, A only)
5.85
6.00
6.15
V
Output at Full Pressure (186PC)
5.90
6.00
6.10
V
Span (184/185PC, G,D)
4.95
5.00
5.05
V
Span (185PC, A only)
4.90
5.00
5.10
V
Span (186PC)
---
5.00
---
V
Span (185PC15AT)
4.28
4.33
4.38
V
Span (185PC30AT)
4.62
4.67
4.72
V
Ratiometricity Error
7 to 8V or 8 to 9V
---
±0.50
---
% Span
9 to 12V
---
±2.00
---
% Span
Temperature Error (Combined null and span) −2%
0
+2%
% Span
Stability over One Year
---
±0.50
---
% Span
Response Time
---
---
1.00
msec
Weight
---
12
---
grams
Short Circuit Protection
Output may be shorted indefinately to
ground
Output Ripple
None, DC device
Ground Reference
Supply and output are common
ENVIRONMENTAL SPECIFICATIONS
Operating Temperature
−40° to +85°C (−40° to +185°F)
Storage Temperature
−55° to +125°C (−67° to +257°F)
Compensated Temperature
0° to +50°C (32° to +122°F)
Shock
MIL-STD-202, Method 213 (50 g, half sine, 6 msec)
Vibration
MIL-STD-202, Method 204 (10 to 2000 Hz at 10 g)
Media
P2 port Wetted materials; polyester housing, epoxy
adhesive, silicon, borosilicate glass, and silicon-to-
glass bond*
P2 port Absolute only: Factory sealed vacuum reference, no
connection
P1 port Dry gases only
*Liquid media containing some highly ionic solutions could potentially neutralize the chip-to-glass tube
bond.



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