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Datenblatt-Suchmaschine für elektronische Bauteile |
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Datenblatt-Suchmaschine für elektronische Bauteile |
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BAS16 Datenblatt(PDF) 17 Page - NXP Semiconductors |
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BAS16 Datenblatt(HTML) 17 Page - NXP Semiconductors |
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17 / 20 page  BAS16_SER_5 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 05 — 25 August 2008 17 of 20 NXP Semiconductors BAS16 series High-speed switching diodes Fig 29. Wave soldering footprint BAS316 (SOD323/SC-76) Reflow soldering is the only recommended soldering method. Fig 30. Reflow soldering footprint BAS516 (SOD523/SC-79) 1.5 (2 ×) 2.9 5 1.2 (2 ×) 2.75 sod323_fw solder lands solder resist occupied area preferred transport direction during soldering Dimensions in mm solder lands solder resist occupied area solder paste Dimensions in mm 0.6 (2 ×) 0.5 (2 ×) 2.15 1.1 0.7 (2 ×) 0.8 (2 ×) 1.2 sod523_fr |
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