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STF5N95K3 Datenblatt(PDF) 5 Page - STMicroelectronics

Teilenummer STF5N95K3
Bauteilbeschribung  N-channel 950 V, 3 ohm typ, 4 A Zener-protected SuperMESH3
PDF  23 Pages
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Hersteller  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STF5N95K3 Datenblatt(HTML) 5 Page - STMicroelectronics

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STD5N95K3, STF5N95K3, STP5N95K3, STU5N95K3
Electrical characteristics
The built-in back-to-back Zener diodes have specifically been designed to enhance not only
the device’s ESD capability, but also to make them safely absorb possible voltage transients
that may occasionally be applied from gate to source. In this respect the Zener voltage is
appropriate to achieve an efficient and cost-effective intervention to protect the device’s
integrity. These integrated Zener diodes thus avoid the usage of external components.
Table 6. Switching times
Symbol
Parameter
Test conditions
Min.
Typ.
Max. Unit
td(on)
Turn-on delay time
VDD = 475 V, ID = 2 A,
RG = 4.7 Ω, VGS = 10 V
(see Figure 19)
-17
-
ns
tr
Rise time
-
7
-
ns
td(off)
Turn-off-delay time
-
32
-
ns
tf
Fall time
-
18
-
ns
Table 7. Source drain diode
Symbol
Parameter
Test conditions
Min.
Typ. Max. Unit
ISD
Source-drain current
-
4
A
ISDM
(1)
1.
Pulse width limited by safe operating area
Source-drain current (pulsed)
-
16
A
VSD
(2)
2.
Pulsed: pulse duration = 300 µs, duty cycle 1.5%
Forward on voltage
ISD = 4 A, VGS = 0
-
1.6
V
trr
Reverse recovery time
ISD = 4 A, di/dt = 100 A/µs
VDD= 60 V
(see Figure 21)
-410
ns
Qrr
Reverse recovery charge
-
3.5
µC
IRRM
Reverse recovery current
-
17
A
trr
Reverse recovery time
ISD = 4 A, di/dt = 100 A/µs
VDD= 60 V TJ = 150 °C
(see Figure 21)
-516
ns
Qrr
Reverse recovery charge
-
4.1
µC
IRRM
Reverse recovery current
-
16
A
Table 8. Gate-source Zener diode
Symbol
Parameter
Test conditions
Min.
Typ.
Max. Unit
V(BR)GSO
Gate-source breakdown
voltage
IGS= ± 1 mA, ID=0
30
-
-
V



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