AD9512-EP

Enhanced Product

Rev. 0 | Page 12 of 20

ABSOLUTE MAXIMUM RATINGS

Table 10.

Parameter

With

Respect

to

Rating

VS

GND

−0.3 V to +3.6 V

DSYNC/DSYNCB

GND

RSET

GND

CLK1, CLK1B, CLK2, CLK2B

GND

CLK1

CLK1B

−1.2 V to +1.2 V

CLK2

CLK2B

−1.2 V to +1.2 V

SCLK, SDIO, SDO, CSB

GND

OUT0, OUT1, OUT2, OUT3,

OUT4

GND

FUNCTION

GND

SYNC STATUS

GND

Junction Temperature

150°C

Storage Temperature Range

−65°C to +150°C

Lead Temperature (10 sec)

300°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

sections of this specification is not implied. Exposure to

absolute maximum ratings for extended periods may affect

device reliability.

THERMAL CHARACTERISTICS

Table 11. Thermal Resistance1

Package Type

Unit

48-Lead LFCSP

28.5

°C/W

1

Thermal impedance measurements were taken on a 4-layer board in still air,

in accordance with EIA/JESD51-7.

ESD CAUTION