LPS001WP datasheet(11/30 Pages) STMICROELECTRONICS

11 / 30 page

LPS001WP

Application hints

Doc ID 18171 Rev 1

11/30

Application hints

Figure 3.

LPS001WP electrical connection

The device core is supplied through the Vdd line. Power supply decoupling capacitors (100

nF ceramic, 10 µF aluminum) should be placed as near as possible to the supply pad of the

device (common design practice).

The functionality of the device and the measured data outputs are selectable and accessible

through the I2C/SPI interface. When using the I2C, CS must be tied high.

It is possible to change, on the fly, the communication interface used to access the device

registers. The PS (Protocol Selection) pin performs this change.

5.1

Soldering information

The HCLGA package is compliant with the ECOPACK® standard.

It is qualified for soldering heat resistance according to JEDEC J-STD-020C.

5.2

Procedure for single acquisition (low power consumption)

If the LPS001WP output data rate requested is lower than 7 Hz, a dedicated procedure to

reduce the power consumption can be implemented.

LPS001WP is in power down, then it is woken up for the acquisition and again put in power

down. This procedure reduces the power consumption.

Obsolete

Product(s)

- Obsolete

Product(s)

LPS001WP Datenblatt(PDF) 11 Page - STMicroelectronics