For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824

Phone: 978-250-3343

Fax: 978-250-3373

Order On-line at www.hittite.com

Application Support: Phone: 978-250-3343 or apps@hittite.com

7

HMC1093

v00.0613

GaAs MMIC SUB HARMONIC

MIXER, 37 - 46.5 GHz

Outline Drawing

NOTES:

1. ALL DIMENSIONS ARE IN INCHES [MM]

2. DIE THICKNESS IS .004”

3. TYPICAL BOND PAD IS 0.0026” [0.066] SQUARE

4. BACKSIDE METALLIZATION: GOLD

5. BOND PAD METALLIZATION: GOLD

6. BACKSIDE METAL IS GROUND.

7. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS.

8. OVERALL DIE SIZE ± .002

ELECTROSTATIC SENSITIVE DEVICE

OBSERVE HANDLING PRECAUTIONS

Absolute Maximum Ratings

Bias Voltage

+3.5V

RF Input Power

+18dBm

LO Input Power

+5dBm

Channel Temperature

175 °C

Continuous Pdiss (T = 85 °C)

(derate 15mW/ °C above 85 °C)

1.6

(channel to die bottom)

66.7 °C/W

Operating Temperature

-55°C to +85°C

Storage Temperature

-65°C to 125°C

ESD Sensitivity (HBM)

Class 0, Passed 150V

Standard

Alternate

GP-2 (Gel Pack)

[2]

[1] Refer to the “Packaging Information” section for die

packaging dimensions.

[2] For alternate packaging information contact Hittite

Microwave Corporation.