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ADS1606IPAPR Datenblatt(PDF) 5 Page - Texas Instruments |
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ADS1606IPAPR Datenblatt(HTML) 5 Page - Texas Instruments |
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5 / 38 page ![]() ADS1605 ADS1606 SBAS274H − MARCH 2003 − REVISED MAY 2007 www.ti.com 5 ELECTRICAL CHARACTERISTICS (continued) All specifications at −40 °C to +85°C, AVDD = 5V, DVDD = IOVDD = 3V, fCLK = 40MHz, External VREF = +3V, 2XMODE = low, VCM = 2.0V, FIFO disabled, and RBIAS = 37kΩ, unless otherwise noted. PARAMETER UNIT MAX TYP MIN TEST CONDITIONS Voltage Reference(1) VREF = (VREFP − VREFN) 2.5 3.0 3.2 V VREFP 3.75 4.0 4.25 V VREFN 0.75 1.0 1.25 V VMID 2.3 2.5 2.8 V VREF drift Internal reference (REFEN = low) 50 ppm/ °C Startup time Internal reference (REFEN = low) 15 ms Clock Input Frequency (fCLK) 40 50 MHz Duty Cycle fCLK = 40MHz 45 55 % Digital Input/Output VIH 0.7 IOVDD IOVDD V VIL DGND 0.3 IOVDD V VOH IOH = 50µA IOVDD − 0.5 V VOL IOL = 50µA DGND +0.5 V Input leakage DGND < VDIGIN < IOVDD ±10 µA Power-Supply Requirements AVDD 4.75 5.25 V DVDD 2.7 3.3 V IOVDD 2.7 5.25 V AVDD current (IAVDD) REFEN = low 110 135 mA AVDD current (IAVDD) REFEN = high 85 105 mA DVDD current (IDVDD) 45 55 mA IOVDD current (IIOVDD) IOVDD = 3V 4 6 mA Power dissipation AVDD = 5V, DVDD = 3V, IOVDD = 3V, REFEN = high 570 710 mW Power dissipation PD = low, CLK disabled 5 mW Temperature Range Specified −40 +85 °C Operating −40 +105 °C Storage −60 +150 °C Thermal Resistance, θJA PowerPAD soldered to PCB with 2oz. trace and copper pad. 25 °C/W θJC PowerPAD soldered to PCB with 2oz. trace and copper pad. 0.5 °C/W (1) The specification limits for VREF, VREFP, VREFN, and VMID apply when using the internal or an external reference. The internal reference voltages are bounded by the limits shown. When using an external reference, the limits indicate the allowable voltages that can be applied to the reference pins. |
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