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AD5560JBCZ Datenblatt(PDF) 63 Page - Analog Devices |
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AD5560JBCZ Datenblatt(HTML) 63 Page - Analog Devices |
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63 / 68 page ![]() Data Sheet AD5560 Rev. D | Page 63 of 68 TEMPERATURE CONTOUR MAP ON THE TOP OF THE PACKAGE TQFP_EP Package Due to localized heating, temperature at the top surface of the package has steep gradient. Thus, the θJC value is highly dependent on where the case temperature is measured. Figure 61 shows the top of the die temperature contour map for the TQFP_EP. BGA Package Due to localized heating, temperature at the top surface of the package has steep gradient. Thus, the θJC value is highly dependent on where the case temperature is measured. Figure 62 shows the top of the die temperature contour map for the flip chip BGA. Figure 61. Temperature Contour Map for 64-Lead TQFP_EP Figure 62. Temperature Contour Map for the Flip Chip BGA |
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