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IO130PDB3V2 Datenblatt(PDF) 162 Page - Microsemi Corporation

Teilenummer IO130PDB3V2
Bauteilbeschribung  Military ProASIC3/EL Low Power Flash FPGAs with Flash*Freeze Technology
PDF  212 Pages
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Hersteller  MICROSEMI [Microsemi Corporation]
Direct Link  http://www.microsemi.com
Logo MICROSEMI - Microsemi Corporation

IO130PDB3V2 Datenblatt(HTML) 162 Page - Microsemi Corporation

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Military ProASIC3/EL DC and Switching Characteristics
2-148
Revision 3
Embedded FlashROM Characteristics
Timing Characteristics
Figure 2-56 • Timing Diagram
A0
A1
tSU
tHOLD
tSU
tHOLD
tSU
tHOLD
tCKQ2
tCKQ2
tCKQ2
CLK
Address
Data
D0
D0
D1
Table 2-216 • Embedded FlashROM Access Time
Military-Case Conditions: TJ = 125°C, Worst-Case VCC = 1.14 V for A3PE600L and
A3PE3000L
Parameter
Description
–1
Std.
Units
tSU
Address Setup Time
0.74
0.87
ns
tHOLD
Address Hold Time
0.00
0.00
ns
tCK2Q
Clock to Out
16.18
19.02
ns
FMAX
Maximum Clock Frequency
15
15
MHz
Note:
For specific junction temperature and voltage supply levels, refer to Table 2-5 on page 2-8 for derating
values.
Table 2-217 • Embedded FlashROM Access Time
Military-Case Conditions: TJ = 125°C, VCC = 1.425 V for A3PE600L and A3PE3000L
Parameter
Description
–1
Std.
Units
tSU
Address Setup Time
0.58
0.68
ns
tHOLD
Address Hold Time
0.00
0.00
ns
tCK2Q
Clock to Out
12.77
15.01
ns
FMAX
Maximum Clock Frequency
15
15
MHz
Note:
For specific junction temperature and voltage supply levels, refer to Table 2-5 on page 2-8 for derating
values.
Table 2-218 • Embedded FlashROM Access Time
Military-Case Conditions: TJ = 125°C, Worst-Case VCC = 1.425 V for A3P250 and
A3P1000
Parameter
Description
–1
Std.
Units
tSU
Address Setup Time
0.64
0.75
ns
tHOLD
Address Hold Time
0.00
0.00
ns
tCK2Q
Clock to Out
19.54
22.97
ns
FMAX
Maximum Clock Frequency
15
15
MHz
Note:
For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-8 for derating
values.



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