CXA2540 datasheet(7/15 Pages) CREE

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XLAMP CXA2530/CXA2540 RETAIL TRACK LIGHT REFERENCE DESIGN

and EasyWhite™ is a trademark of Cree, Inc. For product specifications, please see the data sheets available at www.cree.com. For warranty information, please contact Cree Sales

at sales@cree.com.

We performed thermal simulation to verify that this thermal design is sufficient.7 Figure 3 shows thermal images of

the lamp assembly. The simulated peak solder point temperature (T

SP) is 64 °C, or 39 °C above ambient. The thermal

resistance of the XLamp CXA2530 LeD is 0.8 °C/w, so at 42 w the junction temperature (T

J) will be approximately 98 °C.

figure 3: CXA2530 retail track light thermal simulation

Drive Electronics

Cree selected a dimmable, universal input voltage driver to supply power to the retail track light.8 The driver is a slightly

modified version of a commercially available driver model. The driver, shown in Figure 4, is located off the track and is

attached to the heat sink/housing assembly.

figure 4: CXA2530 retail track light driver

secondary optics

It is a challenge to create a narrow-beam optic for a relatively large light source such as the XLamp CXA2530 LeD. This

design meets the challenge with a custom reflector that is about 89% optically efficient and produces a 16° beam angle.9

The reflector, shown in Figure 5, fits within the heat sink/housing assembly.

For additional information on thermal management, refer to the Thermal Management of Cree XLamp LEDs Application Note, AP05,

www.cree.com/xlamp_app_notes/thermal_management

model erP040w-1000-39, energy recovery Products (erP), www.erppowerllc.com/

model 4-1361-1, Nata Lighting Company Limited, www.nata.cn/

Thermal Simulation / Measurement

Cree Proprietary & Confidential

pg. 8

Thermal Simulation Tsp ~64C,

•About 75% of the 42W input power will convert

to heat and need sufficient heatsink to dissipate

the heat

•Thermal measurement by thermal couple: Tsp

~63.5C

•Calculated Tj ~94C

Tsp

63.5

℃

60.4

℃

Thermal Simulation / Measurement

Cree Proprietary & Confidential

pg. 8

Thermal Simulation Tsp ~64C,

•About 75% of the 42W input power will convert

to heat and need sufficient heatsink to dissipate

the heat

•Thermal measurement by thermal couple: Tsp

~63.5C

•Calculated Tj ~94C

Tsp

63.5

℃

60.4

℃

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