OPA131, 2131, 4131

2

SBOS040A

www.ti.com

SPECIFIED

PACKAGE

TEMPERATURE

PACKAGE

ORDERING

TRANSPORT

PRODUCT

PACKAGE-LEAD

RANGE

MARKING

NUMBER

MEDIA, QUANTITY

Single

OPA131

SO-8

D

–40

°C to +85°C

OPA131UJ

OPA131UJ

Rails, 100

"

"

"

"

"

OPA131UJ/2K5

Tape and Reel, 2500

OPA131

SO-8

D

–40

°C to +85°C

OPA131UA

OPA131UA

Rails, 100

"

"

"

"

"

OPA131UA/2K5

Tape and Reel, 2500

OPA131

SO-8

D

–40

°C to +85°C

OPA131U

OPA131U

Rails, 100

"

"

"

"

"

OPA131U/2K5

Tape and Reel, 2500

Dual

OPA2131

SO-8

D

–40

°C to +85°C

OPA2131UJ

OPA2131UJ

Rails, 100

"

"

"

"

"

OPA2131UJ/2K5

Tape and Reel, 2500

OPA2131

SO-8

D

–40

°C to +85°C

OPA2131UA

OPA2131UA

Rails, 100

"

"

"

"

"

OPA2131UA/2K5

Tape and Reel, 2500

Quad

OPA4131

DIP-14

N

–40

°C to +85°C

OPA4131PJ

OPA4131PJ

Rails, 25

"

"

"

"

OPA4131PA

OPA4131PA

Rails, 25

OPA4131

SOL-16

DW

–40

°C to +85°C

OPA4131UA

OPA4131UA

Rails, 48

"

"

"

"

"

OPA4131UA/1K

Tape and Reel, 1000

OPA4131

SOL-14

D

–40

°C to +85°C

OPA4131NJ

OPA4131NJ

Rails, 58

"

"

"

"

OPA4131NA

OPA4131NA

Rails, 58

Supply Voltage, V+ to V– .................................................................... 36V

Input Voltage .................................................. (V–) – 0.7V to (V+) + 0.7V

Operating Temperature .................................................. –55

°C to +125°C

Storage Temperature ..................................................... –55

°C to +125°C

Junction Temperature ...................................................................... 150

°C

Lead Temperature (soldering, 10s) ................................................. 300

°C

NOTES: (1) Stresses above these ratings may cause permanent damage.

Exposure to absolute maximum conditions for extended periods may degrade

device reliability. (2) Short-circuit to ground, one amplifier per package.

ELECTROSTATIC

DISCHARGE SENSITIVITY

This integrated circuit can be damaged by ESD. Texas Instru-

ments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling

and installation procedures can cause damage.

ESD damage can range from subtle performance degradation

to complete device failure. Precision integrated circuits may be

more susceptible to damage because very small parametric

changes could cause the device not to meet its published

specifications.

PACKAGE/ORDERING INFORMATION

NOTE: (1) For the most current specifications and package information, refer to our web site at www.ti.com.