GRM552B11H102KA01D datasheet(139/221 Pages) MURATA

139 / 221 page

!Caution

s Soldering and Mounting

1. Confirm the best mounting position and direction that

minimizes the stress imposed on the capacitor during

flexing or bending the printed circuit board.

1-1. Choose a mounting position that minimizes the

stress imposed on the chip during flexing or bending

of the board.

1. Mounting Position

Locate chip

horizontal to the

direction in

which stress

acts.

Chip arrangement

Worst A-C-(B~D) Best

[Component Direction]

[Chip Mounting Close to Board Separation Point]

Perforation

Slit

2. Information before Mounting

1. Do not reuse capacitors that were removed from the

equipment.

2. Confirm capacitance characteristics under actual applied

voltage.

3. Confirm the mechanical stress under actual process and

equipment use.

4. Confirm the rated capacitance, rated voltage and other

electrical characteristics before assembly.

5. Prior to use, confirm the solderability of capacitors that

were in long-term storage.

6. Prior to measuring capacitance, carry out a heat

treatment for capacitors that were in long-term storage.

7. The use of Sn-Zn based solder will deteriorate the

reliability of the MLCC.

Please contact our sales representative or product

engineers on the use of Sn-Zn based solder in advance.

Continued on the following page.

3. Maintenance of the Mounting (pick and place) Machine

1. Make sure that the following excessive forces are not

applied to the capacitors.

1-1. In mounting the capacitors on the printed circuit

board, any bending force against them shall be kept

to a minimum to prevent them from any bending

damage or cracking. Please take into account the

following precautions and recommendations for use

in your process.

(1) Adjust the lowest position of the pickup nozzle so

as not to bend the printed circuit board.

(2) Adjust the nozzle pressure within a static load of

1N to 3N during mounting.

2. Dirt particles and dust accumulated between the suction

nozzle and the cylinder inner wall prevent the nozzle from

moving smoothly. This imposes greater force upon the

chip during mounting, causing cracked chips. Also the

locating claw, when worn out, imposes uneven forces on

the chip when positioning, causing cracked chips. The

suction nozzle and the locating claw must be maintained,

checked and replaced periodically.

Board Guide

[Correct]

Suction Nozzle

Board

Support Pin

[Incorrect]

Deflection

!Caution

137

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our

sales representatives or product engineers before ordering.

• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

C02E.pdf

10.12.20

GRM552B11H102KA01D Datenblatt(PDF) 139 Page - Murata Manufacturing Co., Ltd.

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