GRM552B11H102KA01D datasheet(140/221 Pages) MURATA

140 / 221 page

!Caution

4-1. Reflow Soldering

1. When sudden heat is applied to the components, the

mechanical strength of the components will decrease

because a sudden temperature change causes

deformation inside the components. In order to prevent

mechanical damage to the components, preheating is

required for both the components and the PCB board.

Preheating conditions are shown in table 1. It is required to

keep the temperature differential between the solder and

the component's surface (

∆T) as small as possible.

2. Solderability of Tin plating termination chips might be

deteriorated when a low temperature soldering profile

where the peak solder temperature is below the melting

point of Tin is used. Please confirm the Solderability of Tin

plated termination chips before use.

3. When components are immersed in solvent after mounting,

be sure to maintain the temperature difference (

∆T)

between the component and the solvent within the range

shown in the table 1.

GRM02/03/15/18/21/31

GJM03/15

LLL15/18/21/31

LLR18

GQM18/21

GRM32/43/55

LLA18/21/31

LLM21/31

GNM

GQM22

∆TV190°C

∆TV130°C

Part Number

Temperature Differential

Table 1

Recommended Conditions

[Standard Conditions for Reflow Soldering]

[Allowable Reflow Soldering Temperature and Time]

In a case of repeated soldering, the accumulated

soldering time must be within the range shown above.

,,,

Soldering Time (sec.)

260

270

280

250

240

230

220

120

Inverting the PCB

Make sure not to impose any abnormal mechanical shocks

to the PCB.

Continued from the preceding page.

Continued on the following page.

Peak Temperature

Atmosphere

Pb-Sn Solder

Infrared Reflow

230 to 250

°C

Air

Vapor Reflow

230 to 240

°C

Air

Lead Free Solder

240 to 260

°C

Air or N2

Infrared Reflow

Vapor Reflow

60-120 seconds 30-60 seconds

,,,

∆T

Gradual

Cooling

Soldering

Preheating

200

°C

170

°C

150

°C

130

°C

Time

Temperature (

Peak Temperature

60-120 seconds

20 seconds max.

∆T

Gradual

Cooling

Soldering

Preheating

170

°C

150

°C

130

°C

Time

Temperature (

Peak Temperature

,,,

Pb-Sn Solder: Sn-37Pb

Lead Free Solder: Sn-3.0Ag-0.5Cu

4. Optimum Solder Amount for Reflow Soldering

4-1. Overly thick application of solder paste results in a

excessive solder fillet height.

This makes the chip more susceptible to mechanical

and thermal stress on the board and may cause the

chips to crack.

4-2. Too little solder paste results in a lack of adhesive

strength on the outer electrode, which may result in

chips breaking loose from the PCB.

4-3. Make sure the solder has been applied smoothly to

the end surface to a height of 0.2mm* min.

0.2mm∗ min.

∗ GRM02/03: 1/3 of Chip Thickness min.

in section

!Caution

138

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our

sales representatives or product engineers before ordering.

• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

C02E.pdf

10.12.20

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