MPC8360ECVVALFHA datasheet(94/102 Pages) FREESCALE

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MPC8360E/MPC8358E PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications, Rev. 5

Freescale Semiconductor

Thermal Management Information

This table shows heat sinks and junction-to-ambient thermal resistance for TBGA package.

Accurate thermal design requires thermal modeling of the application environment using computational fluid dynamics

software which can model both the conduction cooling and the convection cooling of the air moving through the application.

Simplified thermal models of the packages can be assembled using the junction-to-case and junction-to-board thermal

resistances listed in the thermal resistance table. More detailed thermal models can be made available on request.

Heat sink vendors include the following:

Aavid Thermalloy

603-224-9988

80 Commercial St.

Concord, NH 03301

Internet: www.aavidthermalloy.com

Alpha Novatech

408-749-7601

473 Sapena Ct. #15

Santa Clara, CA 95054

Internet: www.alphanovatech.com

International Electronic Research Corporation (IERC)

818-842-7277

413 North Moss St.

Burbank, CA 91502

Internet: www.ctscorp.com

Table 78. Heat Sinks and Junction-to-Ambient Thermal Resistance of TBGA Package

Heat Sink Assuming Thermal Grease

Airflow

× 35 mm TBGA

Junction-to-Ambient

Thermal Resistance

AAVID 30 × 30 × 9.4 mm pin fin

Natural convention

10.7

AAVID 30 × 30 × 9.4 mm pin fin

1 m/s

6.2

AAVID 30 × 30 × 9.4 mm pin fin

2 m/s

5.3

AAVID 31 × 35 × 23 mm pin fin

Natural convention

8.1

AAVID 31 × 35 × 23 mm pin fin

1 m/s

4.4

AAVID 31 × 35 × 23 mm pin fin

2 m/s

3.7

Wakefield, 53 × 53 × 25 mm pin fin

Natural convention

5.4

Wakefield, 53 × 53 × 25 mm pin fin

1 m/s

3.2

Wakefield, 53 × 53 × 25 mm pin fin

2 m/s

2.4

MEI, 75 × 85 × 12 no adjacent board, extrusion

Natural convention

6.4

MEI, 75 × 85 × 12 no adjacent board, extrusion

1 m/s

3.8

MEI, 75 × 85 × 12 no adjacent board, extrusion

2 m/s

2.5

MEI, 75 × 85 × 12 mm, adjacent board, 40 mm side bypass

1 m/s

2.8

MPC8360ECVVALFHA Datenblatt(PDF) 94 Page - Freescale Semiconductor, Inc

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