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ADA4505-4ACBZ-R7 Datenblatt(PDF) 20 Page - Analog Devices |
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ADA4505-4ACBZ-R7 Datenblatt(HTML) 20 Page - Analog Devices |
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20 / 24 page ![]() ADA4505-1/ADA4505-2/ADA4505-4 Rev. D | Page 20 of 24 COMPLIANT TO JEDEC STANDARDS MO-153-AB-1 8° 0° 4.50 4.40 4.30 14 8 7 1 6.40 BSC PIN 1 5.10 5.00 4.90 0.65 BSC 0.15 0.05 0.30 0.19 1.20 MAX 1.05 1.00 0.80 0.20 0.09 0.75 0.60 0.45 COPLANARITY 0.10 SEATING PLANE Figure 63. 14-Lead Thin Shrink Small Outline Package [TSSOP] (RU-14) Dimensions shown in millimeters A B C D E 0.650 0.595 0.540 1.50 1.46 1.42 3.00 2.96 2.92 1 2 3 BOTTOM VIEW (BALL SIDE UP) TOP VIEW (BALL SIDE DOWN) 0.340 0.320 0.300 2.00 BSC BALL 1 IDENTIFIER SEATING PLANE 1.00 BSC 0.50 BSC 0.50 BSC 0.25 BSC 0.25 BSC 0.25 BSC 0.25 BSC 0.50 BSC 0.50 BSC 0.380 0.355 0.330 0.270 0.240 0.210 0.10 MAX COPLANARITY Figure 64. 14-Ball Wafer Level Chip Scale Package [WLCSP] (CB-14-1) Dimensions shown in millimeters |
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