TCK106G/TCK107G/TCK108G

2012-12-11

6

2.

Power Dissipation

Power dissipation is measured on the board condition shown below.

[The Board Condition]

Board material: Glass epoxy (FR4)

Board dimension: 40mm x 40mm (both sides of board)，t=1.8mm

Metal pattern ratio: a surface approximately 50%, the reverse side approximately 50%

Through hole: diameter 0.5mm x 28

Please allow sufficient margin when designing a board pattern to fit the expected power dissipation. Also take into

consideration the ambient temperature, input voltage, output current etc and applying the appropriate derating for

allowable power dissipation during operation.

0

200

400

600

800

1000

-40

0

40

80

120

Ambient Temperature Ta (℃)