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MP8709EN Datenblatt(PDF) 2 Page - Monolithic Power Systems

Teilenummer MP8709EN
Bauteilbeschribung  High Efficiency 4A, 21V, 500kHz Synchronous Step-down Converter
PDF  14 Pages
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Hersteller  MPS [Monolithic Power Systems]
Direct Link  http://www.monolithicpower.com
Logo MPS - Monolithic Power Systems

MP8709EN Datenblatt(HTML) 2 Page - Monolithic Power Systems

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MP8709 – SYNCHRONOUS STEP-DOWN CONVERTER WITH INTERNAL MOSFETS
MP8709 Rev. 1.01
www.MonolithicPower.com
2
12/14/2011
MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.
© 2011 MPS. All Rights Reserved.
ORDERING INFORMATION
Part Number*
Package
Top Marking
Free Air Temperature (TA)
MP8709EN
SOIC8E
MP8709EN
-20
°C to +85°C
* For Tape & Reel, add suffix –Z (e.g. MP8709EN–Z);
For RoHS compliant packaging, add suffix –LF (e.g. MP8709EN–LF–Z)
PACKAGE REFERENCE
IN
SW
SW
BST
GND
VCC
FB
EN/SYNC
1
2
3
4
8
7
6
5
TOP VIEW
EXPOSED PAD
ON BACKSIDE
CONNECT TO GND
ABSOLUTE MAXIMUM RATINGS (1)
Supply Voltage VIN ....................................... 22V
VSW........................-0.3V (-5V for < 10ns) to 23V
VBS ....................................................... VSW + 6V
All Other Pins..................................-0.3V to +6V
Operating Temperature.............. -20
°C to +85°C
Continuous Power Dissipation (TA = +25°C)
(2)
……………………………………………....2.5W
Junction Temperature...............................150
°C
Lead Temperature ....................................260
°C
Storage Temperature............... -65
°C to +150°C
Recommended Operating Conditions
(3)
Supply Voltage VIN ...........................4.5V to 21V
Operating Junct. Temp (TJ)...... -20°C to +125°C
Thermal Resistance
(4)
θJA
θJC
SOIC8E (Exposed Pad) ..........50 ...... 10 ...
°C/W
Notes:
1) Exceeding these ratings may damage the device.
2) The maximum allowable power dissipation is a function of the
maximum junction temperature TJ(MAX), the junction-to-
ambient thermal resistance θJA, and the ambient temperature
TA. The maximum allowable continuous power dissipation at
any ambient temperature is calculated by PD(MAX)=(TJ(MAX)-
TA)/θJA. Exceeding the maximum allowable power dissipation
will cause excessive die temperature, and the regulator will go
into thermal shutdown. Internal thermal shutdown circuitry
protects the device from permanent damage.
3) The device is not guaranteed to function outside of its
operating conditions.
4) Measured on JESD51-7, 4-layer PCB.



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