MP62350 datasheet(2/12 Pages) MPS

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MP62350/MP62351 –CURRENT-LIMITED POWER DISTRIBUTION SWITCHES

MP62350/MP62351 Rev. 0.91

www.MonolithicPower.com

9/18/2009

MPS Proprietary Information. Unauthorized Photocopy and Duplication Prohibited.

ORDERING INFORMATION

Part Number

Enable

Switch

Maximum

Continuous

Load Current

Typical Short-

Circuit Current

@ TA=25C

Package

Temperature

MP62351ES

Active High

Dual

0.5A

750mA

SOIC8

MP62351EK

Active High

Dual

0.5A

750mA

MSOP8

MP62350ES

Active Low

Dual

0.5A

750mA

SOIC8

MP62350EK

Active Low

Dual

0.5A

750mA

MSOP8

–20

°C to +85°C

* For Tape & Reel, add suffix –Z (eg. MP62350/MP62351ES–Z). For RoHS Compliant Packaging, add suffix –LF

(eg. MP62350/MP62351ES–LF–Z)

PACKAGE REFERENCE

TOP VIEW

EN1*

FLAG1

FLAG2

EN2*

OUT1

GND

OUT2

MSOP8

EN1*

FLAG1

FLAG2

EN2*

OUT1

GND

OUT2

TOP VIEW

SOIC8

*: EN is active high for MP62351

ABSOLUTE MAXIMUM RATINGS

(1)

IN .................................................-0.3V to +6.0V

EN, FLAG, OUT to GND ..............-0.3V to +6.0V

Continuous Power Dissipation (TA = +25°C)

(2)

SOIC8……………………………………......1.4W

MSOP8……………………………………....0.8W

Junction Temperature...............................150°C

Lead Temperature ....................................260°C

Storage Temperature...............–65°C to +150°C

Operating Temperature..............–20°C to +85°C

Thermal Resistance

(3)

θJA

θJC

SOIC8..................................... 90 ...... 42...

°C/W

MSOP8 .................................. 150 ..... 65...

°C/W

Notes:

1) Exceeding these ratings may damage the device.

2) The maximum allowable power dissipation is a function of the

maximum junction temperature TJ(MAX), the junction-to-

ambient thermal resistance θJA, and the ambient temperature

TA. The maximum allowable continuous power dissipation at

any ambient temperature is calculated by PD(MAX)=(TJ(MAX)-

TA)/θJA. Exceeding the maximum allowable power dissipation

will cause excessive die temperature, and the regulator will go

into thermal shutdown. Internal thermal shutdown circuitry

protects the device from permanent damage.

3) Measured on JESD51-7， 4-layer PCB.

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