| Datenblatt-Suchmaschine für elektronische Bauteile |
|
AM7969-125JC Datenblatt(PDF) 125 Page - Advanced Micro Devices |
|
|
|||||||||||||||||||||||||||||
AM7969-125JC Datenblatt(HTML) 125 Page - Advanced Micro Devices |
|
125 / 127 page ![]() AMD 121 TAXIchip Integrated Circuits Technical Manual Assembly/Packaging: CerDIP (CD 028) LCC (CLT028) PLCC (PL 028) Assembly Location: Manila Bangkok Ld. Frame Material: CD: Alloy 42 Copper Bond Wire: 1.25 mil 1.25 mil Au Al/Si (1% Si) Bonding Method: Ultrasonic Ball Bonding Die Attach: Ag Glass Ag Filled Epoxy Molding Compound: N/A Sumitomo 6300H Lead Finish CD 028 Comm.: Tin Plate CD 028 Mil.: Solder Dip CLT028 Mil.: Solder Dip PL 028: Solder Plate Thermal Impedance: CD 0281 CLT0282 PL 0282 θJA TX : 41 °C/W n/a 53 °C/W RX: 43 °C/W n/a 52 °C/W θJC TX, RX: 4 °C/W 10 °C/W 12 °C/W 1 socketed 2 surface mounted |
|
Link URL |
| War ALLDATASHEET hilfreich? [ DONATE ] |
Über Alldatasheet | Werbung | Kontakt | Privatsphäre und Datenschutz | Link zum Datenblatt | Linktausch | Hersteller All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |