| Datenblatt-Suchmaschine für elektronische Bauteile |
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ASM4112CB Datenblatt(PDF) 6 Page - Aplus Intergrated Circuits |
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ASM4112CB Datenblatt(HTML) 6 Page - Aplus Intergrated Circuits |
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6 / 7 page ![]() 1.4 Bonding Diagram 19 18 17 16 15 14 13 12 RC3 RC2 RC1 RC0 GND2 VDD2 TEST OSC ASM4112CB RA3 RA2 RA1 RA0 VDD1 COUT GND1 RB0 RB1 RB2 RB3 1 2 3 4 5 6 7 8 9 10 11 ( 128K x 10-bit ) Block ROM Substrate must be connected to GND. ASM4112CB Pad Location Chip Size: X= 1540+80 (um), Y=2310+80 (um) PAD # PAD Name X Y PAD # PAD Name X Y 1 RA3 -682.16 -1040.2 11 RB3 667.68 -1040.2 2 RA2 -559.84 -1040.2 12 OSC 633.56 1071.52 3 RA1 -437.52 -1040.2 13 TEST 432.48 1071.52 4 RA0 -315.2 -1040.2 14 VDD2 273.16 1071.52 5 VDD1 -191.28 -1040.2 15 GND2 134.68 1071.52 6 COUT 71.12 -1040.2 16 RC0 -51.76 1071.52 7 GND1 189.52 -1040.2 17 RC1 -248.4 1071.52 8 RB0 307.92 -1040.2 18 RC2 -454.24 1071.52 9 RB1 430.24 -1040.2 19 RC3 -650.88 1071.52 10 RB2 552.56 -1040.2 ASM4112CB X= 1540+80 (um) Y=2310+80 (um) |
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