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LM317S/NOPB Datenblatt(PDF) 13 Page - Texas Instruments |
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LM317S/NOPB Datenblatt(HTML) 13 Page - Texas Instruments |
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13 / 40 page ![]() LM117, LM317A, LM317-N www.ti.com SNVS774O – MAY 2004 – REVISED JANUARY 2014 Figure 26. θ(J−A) vs Copper (2 ounce) Area for the SOT-223 Package Figure 27. Maximum Power Dissipation vs TAMB for the SOT-223 Package Heatsinking the TO-263 (KTT) Package Figure 28 shows for the TO-263 the measured values of θ(J−A) for different copper area sizes using a typical PCB with 1 ounce copper and no solder mask over the copper area used for heatsinking. As shown in Figure 28, increasing the copper area beyond 1 square inch produces very little improvement. It should also be observed that the minimum value of θ(J−A) for the TO-263 package mounted to a PCB is 32°C/W. Figure 28. θ(J−A) vs Copper (1 ounce) Area for the TO-263 Package Copyright © 2004–2014, Texas Instruments Incorporated Submit Documentation Feedback 13 Product Folder Links: LM117 LM317A LM317-N |
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