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Datenblatt-Suchmaschine für elektronische Bauteile |
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Datenblatt-Suchmaschine für elektronische Bauteile |
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LT1769IGN Datenblatt(PDF) 2 Page - Linear Integrated Systems |
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LT1769IGN Datenblatt(HTML) 2 Page - Linear Integrated Systems |
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2 / 16 page  2 LT1769 1769fa ABSOLUTE MAXIMUM RATINGS PACKAGE/ORDER INFORMATION ORDER PART NUMBER *ALL VCC PINS SHOULD BE CONNECTED TOGETHER CLOSE TO THE PINS ** ALL GND PINS ARE FUSED TO INTERNAL DIE ATTACH PADDLE FOR HEAT SINKING. CONNECT THESE PINS TO EXPANDED PC LANDS FOR PROPER HEAT SINKING. 35 °C/W THERMAL RESISTANCE ASSUMES AN INTERNAL GROUND PLANE DOUBLING AS A HEAT SPREADER LT1769CGN LT1769IGN TJMAX = 125°C, θJA = 35°C/ W** 1 2 3 4 5 6 7 8 9 10 11 12 13 14 TOP VIEW GN PACKAGE 28-LEAD PLASTIC SSOP 28 27 26 25 24 23 22 21 20 19 18 17 16 15 GND** GND** GND** SW BOOST UV GND** GND** OVP CLP CLN COMP1 SENSE GND** GND** GND** GND** VCC1* VCC2* VCC3* GND** PROG VC UVOUT COMP2 BAT SPIN GND** Supply Voltage (VCC, CLP and CLN Pin Voltage) ......................... 30V BOOST Pin Voltage with Respect to VCC ................. 25V IBAT (Average)........................................................... 2A Operating Junction Temperature Range Commercial ........................................... 0 °C to 125°C Industrial ......................................... – 40 °C to 125°C Consult LTC Marketing for parts specified with wider operating temperature ranges. (Note 1) Operating Ambient Temperature Commercial ............................................ 0 °C to 70°C Industrial ........................................... – 40 °C to 85°C Storage Temperature Range ................. – 65 °C to 150°C Lead Temperature (Soldering, 10 sec).................. 300 °C ORDER PART NUMBER LT1769CFE LT1769IFE FE PACKAGE 20-LEAD PLASTIC TSSOP 1 2 3 4 5 6 7 8 9 10 TOP VIEW 20 19 18 17 16 15 14 13 12 11 SW BOOST UV GND GND OVP CLN CLP COMP1 SENSE GND VCC1 VCC2 VCC3 PROG VC GND UVOUT BAT SPIN TJMAX = 125°C, θJA = 35°C/ W† †THE BOTTOM METAL PLATE OF THIS PACKAGE IS FUSED TO INTERNAL GROUND AND IS FOR HEAT SINKING. SOLDER THE BOTTOM METAL PLATE ONTO PCB GROUND PLANE FOR HEAT SINKING. ELECTRICAL CHARACTERISTICS The q denotes specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C. VCC = 16V, VBAT = 8V, RS2 = RS3 = 200Ω (see Block Diagram), VCLN = VCC. No load on any outputs unless otherwise noted. PARAMETER CONDITIONS MIN TYP MAX UNITS Overall Supply Current VPROG = 2.7V, VCC ≤ 20V q 4.5 6.8 mA VPROG = 2.7V, 20V < VCC ≤ 25V q 4.6 7.0 mA Sense Amplifier CA1 Gain and Input Offset Voltage 8V ≤ VCC ≤ 25V , 0V ≤ VBAT ≤ 20V (With RS2 = 200Ω, RS3 = 200Ω)RPROG = 4.93k q 93 100 107 mV (Measured across RS1)(Note 2) RPROG = 49.3k q 810 12 mV TA < 0°C7 13 mV VCC = 28V, VBAT = 20V RPROG = 4.93k q 90 110 mV RPROG = 49.3k q 713 mV TA < 0°C6 14 mV EXPOSED PAD IS GROUND (MUST BE SOLDERED TO PCB) EXPOSED PAD SIZE: 3.0 (.188) × 4.1 (.162) |
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