MCP23009TESS datasheet(39/50 Pages) MICROCHIP

39 / 50 page

DS22121B-page 39

MCP23009/MCP23S09

3.0

PACKAGING INFORMATION

3.1

Package Marking Information

Legend: XX...X

Customer-specific information

Year code (last digit of calendar year)

Year code (last 2 digits of calendar year)

Week code (week of January 1 is week ‘01’)

NNN

Alphanumeric traceability code

Pb-free JEDEC designator for Matte Tin (Sn)

This package is Pb-free. The Pb-free JEDEC designator (

)

can be found on the outer packaging for this package.

Note:

In the event the full Microchip part number cannot be marked on one line, it will

be carried over to the next line, thus limiting the number of available

characters for customer-specific information.

18-Lead PDIP (300 mil)

Example:

18-Lead SOIC (300 mil)

Example:

XXXXXXXXXXXX

YYWWNNN

XXXXXXXXXXXX

MCP23009

0919256

E/P^^

XXXXXXXXXXXXXXXXX

YYWWNNN

XXXXXXXXXXXXXXXXX

MCP23009

E/SO^^

256

0919

YYWWNNN

XXXXXXXXXXX

MCP23009

E/SS^^

0919

256

20-Lead SSOP (300 mil)

Example:

16-Lead QFN (3x3 mm)

Example

XXX

EYWW

NNN

239

E919

256

MCP23009TESS Datenblatt(PDF) 39 Page - Microchip Technology

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