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OPA355 Datenblatt(PDF) 2 Page - Texas Instruments

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Teilenummer OPA355
Bauteilbeschribung  200MHz, CMOS OPERATIONAL AMPLIFIER WITH SHUTDOWN
PDF  27 Pages
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Hersteller  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

OPA355 Datenblatt(HTML) 2 Page - Texas Instruments

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OPA355, 2355, 3355
SBOS195D
2
www.ti.com
ABSOLUTE MAXIMUM RATINGS(1)
Supply Voltage, V+ to V– ................................................................... 7.5V
Signal Input Terminals, Voltage(2) .................... (V–) – 0.5V to (V+) + 0.5V
Current(2) ..................................................... 10mA
Enable Input ...................................................... (V–) – 0.5V to (V+) + 0.5V
Output Short-Circuit(3) .............................................................. Continuous
Operating Temperature .................................................. –55
°C to +150°C
Storage Temperature ...................................................... –65
°C to +150°C
Junction Temperature .................................................................... +160
°C
Lead Temperature (soldering, 10s) ............................................... +300
°C
NOTES: (1) Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods may degrade
device reliability. These are stress ratings only, and functional operation of the
device at these or any other conditions beyond those specified is not implied.
(2) Input terminals are diode-clamped to the power-supply rails. Input signals
that can swing more than 0.5V beyond the supply rails should be current limited
to 10mA or less. (3) Short-circuit to ground, one amplifier per package.
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Texas Instru-
ments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degrada-
tion to complete device failure. Precision integrated circuits
may be more susceptible to damage because very small
parametric changes could cause the device not to meet its
published specifications.
PIN CONFIGURATIONS
Top View
1
2
3
6
5
4
V+
Enable
–In
Out
V–
+In
OPA355
SOT23-6(1)
1
2
3
4
8
7
6
5
Enable
V+
Out
NC(2)
NC(2)
–In
+In
V–
OPA355
SO-8
1
2
3
4
5
10
9
8
7
6
V+
Out B
–In B
+In B
Enable B
Out A
–In A
+In A
V–
Enable A
OPA2355
MSOP-10
A
B
1
2
3
4
5
6
7
14
13
12
11
10
9
8
Out C
–In C
+In C
V–
+In B
–In B
Out B
Enable A
Enable B
Enable C
V+
+In A
–In A
Out A
OPA3355
SO-14
TSSOP-14
AB
C
PACKAGE
PRODUCT
PACKAGE-LEAD
MARKING
OPA355
SOT23-6
C55
""
"
OPA355
SO-8
OPA355UA
""
"
OPA2355
MSOP-10
D55
""
"
OPA3355
TSSOP-14
OPA3355EA
""
"
OPA3355
SO-14
OPA3355UA
""
"
NOTE: (1) For the most current package and ordering information, see the
Package Option Addendum located at the end of this data sheet.
PACKAGE/ORDERING INFORMATION(1)
NOTES: (1) Pin 1 of the SOT23-6 is
determined by orienting the package marking
as indicated in the diagram. (2) NC indicates
no internal connection.



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