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DS276 Datenblatt(PDF) 6 Page - Dallas Semiconductor

Teilenummer DS276
Bauteilbeschribung  Low Power Transceiver Chip
PDF  11 Pages
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Hersteller  DALLAS [Dallas Semiconductor]
Direct Link  https://www.maximintegrated.com/en.html
Logo DALLAS - Dallas Semiconductor

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DS276
6 of 11
ABSOLUTE MAXIMUM RATINGS*
VCC
-0.3V to +7.0V
VDR+
-0.3V to +13V
VDR-
-13V to +0.3V
RXIN
-15V to +15V
TXIN
-0.3V to VCC+0.3V
TXOUT
-15V to +15V
RXOUT
-0.3V to VCC+0.3V
Operating Temperature
0°C to 70°C
Storage Temperature
-55°C to +125°C
Soldering Temperature
260°C for 10 seconds
*
This is a stress rating only and functional operation of the device at these or any other conditions
above those indicated in the operation sections of this specification is not implied. Exposure to
absolute maximum rating conditions for extended periods of time may affect reliability.
RECOMMENDED DC OPERATING CONDITIONS
(tA = 0
°C to 70°C)
PARAMETER
SYMBOL
CONDITION
MIN
TYP
MAX
UNITS
NOTES
Logic Supply Voltage
VCC
2.7
3-5
5.5
V
1
Transmit Driver Supply
VDR+
VDR+
VCC=5V
±10%
VCC 2.7-3.6V
VCC
VCC
5-12
3-5
13
5.5
V
V
1
1
Transmit Driver Supply
VDR-
-15
0
V
1
High-level Input Voltage
VIH
2VCC
+0.3
V
Low-level Input Voltage
VIL
-0.3
0.8
V
RXIN Input Voltage
VRS
-15
+15
V
1
ELECTRICAL CHARACTERISTICS-3V OPERATION
(tA = 0
°C to 70°C)
PARAMETER
SYMBOL
MIN
TYP
MAX
UNITS
NOTES
Logic Supply Voltage
VCC
2.7
3.6
V
Dynamic Supply Current
IDRV1
ICC1
IDRV1
ICC1
TXIN = VCC
TXIN = VCC
TXIN = GND
TXIN = GND
400
40
3.8
40
800
100
5
100
uA
uA
mA
uA
2
2
2
2
Static Supply Current
IDRV2
ICC2
IDRV2
ICC2
TXIN = VCC
TXIN = VCC
TXIN = GND
TXIN = GND
1.5
10
3.8
10
10
15
5
20
uA
uA
mA
uA
3
3
3
3
Driver Leakage Current
IDRV3
VCC = 0
0.05
1
uA
4
VDRV+=VCC=
2.7V
VDRV-=0
2
2.4
V
5
TXOUT Level High
VOTXH
VDRV+=4.5V,
VDRV-=-12V
3.8
4
V
6



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