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STM8AFP5268 Datenblatt(PDF) 99 Page - STMicroelectronics |
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STM8AFP5268 Datenblatt(HTML) 99 Page - STMicroelectronics |
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99 / 114 page ![]() DocID14395 Rev 10 99/114 STM8AF52/62xx, STM8AF51/61xx Package characteristics 113 Figure 52. VFQFPN 32-lead very thin fine pitch quad flat no-lead package (5 x 5) 1. There is an exposed die pad on the underside of the VFQFPN package. It is recommended to connect and solder this backside pad to PCB ground. 2. The drawing is not to scale. 3. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life. Seating plane ddd C C A3 A1 A D e 9 16 17 24 32 Pin 1 ID R 0.30 8 E L L D2 1 b E2 42_ME Bottom view |
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